AM27S25SA/B3C
vs
5962-8851801LA
feature comparison
All Stats
Differences Only
Part Life Cycle Code
Active
Obsolete
Ihs Manufacturer
ROCHESTER ELECTRONICS LLC
CYPRESS SEMICONDUCTOR CORP
Package Description
QCCN,
DIP,
Reach Compliance Code
unknown
unknown
ECCN Code
EAR99
3A001.A.2.C
HTS Code
8542.32.00.71
8542.32.00.61
JESD-30 Code
S-CQCC-N28
R-GDIP-T24
Length
11.43 mm
31.877 mm
Memory Density
4096 bit
4096 bit
Memory IC Type
OTP ROM
UVPROM
Memory Width
8
8
Number of Functions
1
1
Number of Terminals
28
24
Number of Words
512 words
512 words
Number of Words Code
512
512
Operating Mode
SYNCHRONOUS
SYNCHRONOUS
Operating Temperature-Max
125 °C
125 °C
Operating Temperature-Min
-55 °C
-55 °C
Organization
512X8
512X8
Package Body Material
CERAMIC, METAL-SEALED COFIRED
CERAMIC, GLASS-SEALED
Package Code
QCCN
DIP
Package Shape
SQUARE
RECTANGULAR
Package Style
CHIP CARRIER
IN-LINE
Parallel/Serial
PARALLEL
PARALLEL
Peak Reflow Temperature (Cel)
NOT SPECIFIED
Seated Height-Max
1.905 mm
5.08 mm
Supply Current-Max
0.185 mA
Supply Voltage-Max (Vsup)
5.5 V
5.5 V
Supply Voltage-Min (Vsup)
4.5 V
4.5 V
Supply Voltage-Nom (Vsup)
5 V
5 V
Surface Mount
YES
NO
Technology
BIPOLAR
CMOS
Temperature Grade
MILITARY
MILITARY
Terminal Form
NO LEAD
THROUGH-HOLE
Terminal Pitch
1.27 mm
2.54 mm
Terminal Position
QUAD
DUAL
Time@Peak Reflow Temperature-Max (s)
NOT SPECIFIED
Width
11.43 mm
7.62 mm
Base Number Matches
2
3
Part Package Code
DIP
Pin Count
24
JESD-609 Code
e0
Output Characteristics
3-STATE
Qualification Status
Not Qualified
Terminal Finish
TIN LEAD
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