AM27S25A/B3A vs TBP28L46NW feature comparison

AM27S25A/B3A AMD

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TBP28L46NW Texas Instruments

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Rohs Code No No
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer ADVANCED MICRO DEVICES INC TEXAS INSTRUMENTS INC
Part Package Code QLCC DIP
Package Description QCCN, LCC28,.45SQ DIP, DIP24,.6
Pin Count 28 24
Reach Compliance Code unknown not_compliant
ECCN Code EAR99 EAR99
HTS Code 8542.32.00.71 8542.32.00.71
Factory Lead Time 4 Weeks
Access Time-Max 50 ns 95 ns
JESD-30 Code S-CQCC-N28 R-PDIP-T24
JESD-609 Code e0
Length 11.43 mm 31.75 mm
Memory Density 8192 bit 4096 bit
Memory IC Type OTP ROM OTP ROM
Memory Width 8 8
Number of Functions 1 1
Number of Terminals 28 24
Number of Words 512 words 512 words
Number of Words Code 1000 512
Operating Mode ASYNCHRONOUS ASYNCHRONOUS
Operating Temperature-Max 125 °C 70 °C
Operating Temperature-Min -55 °C
Organization 1KX8 512X8
Output Characteristics 3-STATE
Package Body Material CERAMIC, METAL-SEALED COFIRED PLASTIC/EPOXY
Package Code QCCN DIP
Package Equivalence Code LCC28,.45SQ DIP24,.6
Package Shape SQUARE RECTANGULAR
Package Style CHIP CARRIER IN-LINE
Parallel/Serial PARALLEL PARALLEL
Qualification Status Not Qualified Not Qualified
Screening Level 38535Q/M;38534H;883B
Seated Height-Max 1.905 mm 5.08 mm
Supply Voltage-Max (Vsup) 5.5 V 5.25 V
Supply Voltage-Min (Vsup) 4.5 V 4.75 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount YES NO
Technology BIPOLAR BIPOLAR
Temperature Grade MILITARY COMMERCIAL
Terminal Finish Tin/Lead (Sn/Pb)
Terminal Form NO LEAD THROUGH-HOLE
Terminal Pitch 1.27 mm 2.54 mm
Terminal Position QUAD DUAL
Width 11.43 mm 15.24 mm
Base Number Matches 1 1
Peak Reflow Temperature (Cel) NOT SPECIFIED
Supply Current-Max 0.085 mA
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED

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