AM27S25A/B3A vs 5962-8851803LA feature comparison

AM27S25A/B3A AMD

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5962-8851803LA Cypress Semiconductor

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Rohs Code No
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer ADVANCED MICRO DEVICES INC CYPRESS SEMICONDUCTOR CORP
Part Package Code QLCC DIP
Package Description QCCN, LCC28,.45SQ DIP,
Pin Count 28 24
Reach Compliance Code unknown unknown
ECCN Code EAR99 3A001.A.2.C
HTS Code 8542.32.00.71 8542.32.00.61
Factory Lead Time 4 Weeks
Access Time-Max 50 ns
JESD-30 Code S-CQCC-N28 R-GDIP-T24
JESD-609 Code e0 e0
Length 11.43 mm 31.877 mm
Memory Density 8192 bit 4096 bit
Memory IC Type OTP ROM UVPROM
Memory Width 8 8
Number of Functions 1 1
Number of Terminals 28 24
Number of Words 512 words 512 words
Number of Words Code 1000 512
Operating Mode ASYNCHRONOUS SYNCHRONOUS
Operating Temperature-Max 125 °C 125 °C
Operating Temperature-Min -55 °C -55 °C
Organization 1KX8 512X8
Output Characteristics 3-STATE 3-STATE
Package Body Material CERAMIC, METAL-SEALED COFIRED CERAMIC, GLASS-SEALED
Package Code QCCN DIP
Package Equivalence Code LCC28,.45SQ
Package Shape SQUARE RECTANGULAR
Package Style CHIP CARRIER IN-LINE
Parallel/Serial PARALLEL PARALLEL
Qualification Status Not Qualified Not Qualified
Screening Level 38535Q/M;38534H;883B
Seated Height-Max 1.905 mm 5.08 mm
Supply Voltage-Max (Vsup) 5.5 V 5.5 V
Supply Voltage-Min (Vsup) 4.5 V 4.5 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount YES NO
Technology BIPOLAR CMOS
Temperature Grade MILITARY MILITARY
Terminal Finish Tin/Lead (Sn/Pb) TIN LEAD
Terminal Form NO LEAD THROUGH-HOLE
Terminal Pitch 1.27 mm 2.54 mm
Terminal Position QUAD DUAL
Width 11.43 mm 7.62 mm
Base Number Matches 1 1

Compare AM27S25A/B3A with alternatives

Compare 5962-8851803LA with alternatives