AM27S25A/B3A
vs
5962-8851803LA
feature comparison
Rohs Code |
No
|
|
Part Life Cycle Code |
Obsolete
|
Obsolete
|
Ihs Manufacturer |
ADVANCED MICRO DEVICES INC
|
CYPRESS SEMICONDUCTOR CORP
|
Part Package Code |
QLCC
|
DIP
|
Package Description |
QCCN, LCC28,.45SQ
|
DIP,
|
Pin Count |
28
|
24
|
Reach Compliance Code |
unknown
|
unknown
|
ECCN Code |
EAR99
|
3A001.A.2.C
|
HTS Code |
8542.32.00.71
|
8542.32.00.61
|
Factory Lead Time |
4 Weeks
|
|
Access Time-Max |
50 ns
|
|
JESD-30 Code |
S-CQCC-N28
|
R-GDIP-T24
|
JESD-609 Code |
e0
|
e0
|
Length |
11.43 mm
|
31.877 mm
|
Memory Density |
8192 bit
|
4096 bit
|
Memory IC Type |
OTP ROM
|
UVPROM
|
Memory Width |
8
|
8
|
Number of Functions |
1
|
1
|
Number of Terminals |
28
|
24
|
Number of Words |
512 words
|
512 words
|
Number of Words Code |
1000
|
512
|
Operating Mode |
ASYNCHRONOUS
|
SYNCHRONOUS
|
Operating Temperature-Max |
125 °C
|
125 °C
|
Operating Temperature-Min |
-55 °C
|
-55 °C
|
Organization |
1KX8
|
512X8
|
Output Characteristics |
3-STATE
|
3-STATE
|
Package Body Material |
CERAMIC, METAL-SEALED COFIRED
|
CERAMIC, GLASS-SEALED
|
Package Code |
QCCN
|
DIP
|
Package Equivalence Code |
LCC28,.45SQ
|
|
Package Shape |
SQUARE
|
RECTANGULAR
|
Package Style |
CHIP CARRIER
|
IN-LINE
|
Parallel/Serial |
PARALLEL
|
PARALLEL
|
Qualification Status |
Not Qualified
|
Not Qualified
|
Screening Level |
38535Q/M;38534H;883B
|
|
Seated Height-Max |
1.905 mm
|
5.08 mm
|
Supply Voltage-Max (Vsup) |
5.5 V
|
5.5 V
|
Supply Voltage-Min (Vsup) |
4.5 V
|
4.5 V
|
Supply Voltage-Nom (Vsup) |
5 V
|
5 V
|
Surface Mount |
YES
|
NO
|
Technology |
BIPOLAR
|
CMOS
|
Temperature Grade |
MILITARY
|
MILITARY
|
Terminal Finish |
Tin/Lead (Sn/Pb)
|
TIN LEAD
|
Terminal Form |
NO LEAD
|
THROUGH-HOLE
|
Terminal Pitch |
1.27 mm
|
2.54 mm
|
Terminal Position |
QUAD
|
DUAL
|
Width |
11.43 mm
|
7.62 mm
|
Base Number Matches |
1
|
1
|
|
|
|
Compare AM27S25A/B3A with alternatives
Compare 5962-8851803LA with alternatives