AM27S23PC
vs
TBP28LA22N
feature comparison
All Stats
Differences Only
Pbfree Code
Rohs Code
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
ADVANCED MICRO DEVICES INC
TEXAS INSTRUMENTS INC
Part Package Code
DIP
DIP
Package Description
DIP, DIP20,.3
DIP, DIP20,.3
Pin Count
20
20
Reach Compliance Code
unknown
not_compliant
ECCN Code
EAR99
EAR99
HTS Code
8542.32.00.71
8542.32.00.71
Access Time-Max
45 ns
65 ns
JESD-30 Code
R-PDIP-T20
R-PDIP-T20
JESD-609 Code
e0
Length
26.035 mm
24.325 mm
Memory Density
2048 bit
512 bit
Memory IC Type
OTP ROM
OTP ROM
Memory Width
8
1
Number of Functions
1
1
Number of Terminals
20
20
Number of Words
256 words
256 words
Number of Words Code
256
212942
Operating Mode
ASYNCHRONOUS
ASYNCHRONOUS
Operating Temperature-Max
75 °C
70 °C
Operating Temperature-Min
Organization
256X8
64X8
Output Characteristics
3-STATE
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
DIP
DIP
Package Equivalence Code
DIP20,.3
DIP20,.3
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
IN-LINE
IN-LINE
Parallel/Serial
PARALLEL
PARALLEL
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
5.08 mm
5.08 mm
Supply Current-Max
0.16 mA
0.1 mA
Supply Voltage-Max (Vsup)
5.25 V
Supply Voltage-Min (Vsup)
4.75 V
Supply Voltage-Nom (Vsup)
5 V
5 V
Surface Mount
NO
NO
Technology
BIPOLAR
BIPOLAR
Temperature Grade
COMMERCIAL EXTENDED
COMMERCIAL
Terminal Finish
TIN LEAD
Terminal Form
THROUGH-HOLE
THROUGH-HOLE
Terminal Pitch
2.54 mm
2.54 mm
Terminal Position
DUAL
DUAL
Width
7.62 mm
7.62 mm
Base Number Matches
2
5
Peak Reflow Temperature (Cel)
NOT SPECIFIED
Time@Peak Reflow Temperature-Max (s)
NOT SPECIFIED
Compare AM27S23PC with alternatives
Compare TBP28LA22N with alternatives