AM27S23DC vs AM27S23PCB feature comparison

AM27S23DC Rochester Electronics LLC

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AM27S23PCB AMD

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Part Life Cycle Code Active Obsolete
Ihs Manufacturer ROCHESTER ELECTRONICS LLC ADVANCED MICRO DEVICES INC
Package Description DIP, DIP, DIP20,.3
Reach Compliance Code unknown unknown
ECCN Code EAR99 EAR99
HTS Code 8542.32.00.71 8542.32.00.71
Access Time-Max 45 ns 45 ns
JESD-30 Code R-CDIP-T20 R-PDIP-T20
Length 24.257 mm 26.035 mm
Memory Density 2048 bit 2048 bit
Memory IC Type OTP ROM OTP ROM
Memory Width 8 8
Number of Functions 1 1
Number of Terminals 20 20
Number of Words 256 words 256 words
Number of Words Code 256 256
Operating Mode ASYNCHRONOUS ASYNCHRONOUS
Operating Temperature-Max 75 °C 75 °C
Operating Temperature-Min
Organization 256X8 256X8
Package Body Material CERAMIC, METAL-SEALED COFIRED PLASTIC/EPOXY
Package Code DIP DIP
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE IN-LINE
Parallel/Serial PARALLEL PARALLEL
Peak Reflow Temperature (Cel) NOT SPECIFIED
Seated Height-Max 5.08 mm 5.08 mm
Supply Voltage-Max (Vsup) 5.25 V 5.25 V
Supply Voltage-Min (Vsup) 4.75 V 4.75 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount NO NO
Technology BIPOLAR BIPOLAR
Temperature Grade COMMERCIAL EXTENDED COMMERCIAL EXTENDED
Terminal Form THROUGH-HOLE THROUGH-HOLE
Terminal Pitch 2.54 mm 2.54 mm
Terminal Position DUAL DUAL
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED
Width 7.62 mm 7.62 mm
Base Number Matches 2 1
Pbfree Code No
Rohs Code No
Part Package Code DIP
Pin Count 20
JESD-609 Code e0
Output Characteristics 3-STATE
Package Equivalence Code DIP20,.3
Qualification Status Not Qualified
Supply Current-Max 0.16 mA
Terminal Finish TIN LEAD

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