AM27S19SAFC vs 63S081AWXXXX feature comparison

AM27S19SAFC AMD

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63S081AWXXXX

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Rohs Code No
Part Life Cycle Code Obsolete
Ihs Manufacturer ADVANCED MICRO DEVICES INC
Part Package Code DFP
Package Description DFP, FL16,.3
Pin Count 16
Reach Compliance Code unknown
ECCN Code EAR99
HTS Code 8542.32.00.71
Access Time-Max 15 ns
JESD-30 Code R-GDFP-F16
JESD-609 Code e0
Length 10.16 mm
Memory Density 256 bit
Memory IC Type OTP ROM
Memory Width 8
Number of Functions 1
Number of Terminals 16
Number of Words 32 words
Number of Words Code 32
Operating Mode ASYNCHRONOUS
Operating Temperature-Max 75 °C
Operating Temperature-Min
Organization 32X8
Output Characteristics 3-STATE
Package Body Material CERAMIC, GLASS-SEALED
Package Code DFP
Package Equivalence Code FL16,.3
Package Shape RECTANGULAR
Package Style FLATPACK
Parallel/Serial PARALLEL
Qualification Status Not Qualified
Seated Height-Max 2.159 mm
Supply Current-Max 0.115 mA
Supply Voltage-Max (Vsup) 5.25 V
Supply Voltage-Min (Vsup) 4.75 V
Supply Voltage-Nom (Vsup) 5 V
Surface Mount YES
Technology BIPOLAR
Temperature Grade COMMERCIAL EXTENDED
Terminal Finish Tin/Lead (Sn/Pb)
Terminal Form FLAT
Terminal Pitch 1.27 mm
Terminal Position DUAL
Width 6.731 mm
Base Number Matches 1

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