AM27S19ADC
vs
63S081J
feature comparison
| Pbfree Code |
No
|
|
| Rohs Code |
No
|
|
| Part Life Cycle Code |
Obsolete
|
|
| Ihs Manufacturer |
ADVANCED MICRO DEVICES INC
|
|
| Part Package Code |
DIP
|
|
| Package Description |
DIP, DIP16,.3
|
|
| Pin Count |
16
|
|
| Reach Compliance Code |
unknown
|
|
| ECCN Code |
EAR99
|
|
| HTS Code |
8542.32.00.71
|
|
| Access Time-Max |
25 ns
|
|
| JESD-30 Code |
R-GDIP-T16
|
|
| JESD-609 Code |
e0
|
|
| Length |
19.431 mm
|
|
| Memory Density |
256 bit
|
|
| Memory IC Type |
OTP ROM
|
|
| Memory Width |
8
|
|
| Number of Functions |
1
|
|
| Number of Terminals |
16
|
|
| Number of Words |
32 words
|
|
| Number of Words Code |
32
|
|
| Operating Mode |
ASYNCHRONOUS
|
|
| Operating Temperature-Max |
75 °C
|
|
| Operating Temperature-Min |
|
|
| Organization |
32X8
|
|
| Output Characteristics |
3-STATE
|
|
| Package Body Material |
CERAMIC, GLASS-SEALED
|
|
| Package Code |
DIP
|
|
| Package Equivalence Code |
DIP16,.3
|
|
| Package Shape |
RECTANGULAR
|
|
| Package Style |
IN-LINE
|
|
| Parallel/Serial |
PARALLEL
|
|
| Peak Reflow Temperature (Cel) |
NOT SPECIFIED
|
|
| Qualification Status |
Not Qualified
|
|
| Seated Height-Max |
5.08 mm
|
|
| Supply Current-Max |
0.115 mA
|
|
| Supply Voltage-Max (Vsup) |
5.25 V
|
|
| Supply Voltage-Min (Vsup) |
4.75 V
|
|
| Supply Voltage-Nom (Vsup) |
5 V
|
|
| Surface Mount |
NO
|
|
| Technology |
BIPOLAR
|
|
| Temperature Grade |
COMMERCIAL EXTENDED
|
|
| Terminal Form |
THROUGH-HOLE
|
|
| Terminal Pitch |
2.54 mm
|
|
| Terminal Position |
DUAL
|
|
| Time@Peak Reflow Temperature-Max (s) |
NOT SPECIFIED
|
|
| Width |
7.62 mm
|
|
| Base Number Matches |
1
|
|
|
|
|
Compare AM27S19ADC with alternatives