AM27S13PC vs DM74S570J feature comparison

AM27S13PC AMD

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DM74S570J Texas Instruments

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Pbfree Code No
Rohs Code No No
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer ADVANCED MICRO DEVICES INC NATIONAL SEMICONDUCTOR CORP
Part Package Code DIP DIP
Package Description DIP, DIP16,.3 DIP, DIP16,.3
Pin Count 16 16
Reach Compliance Code unknown unknown
ECCN Code EAR99 EAR99
HTS Code 8542.32.00.71 8542.32.00.71
Access Time-Max 200 ns 55 ns
JESD-30 Code R-PDIP-T16 R-GDIP-T16
JESD-609 Code e0 e0
Length 19.05 mm 19.43 mm
Memory Density 1048576 bit 2048 bit
Memory IC Type OTP ROM OTP ROM
Memory Width 8 4
Number of Functions 1 1
Number of Terminals 16 16
Number of Words 512 words 512 words
Number of Words Code 128000 512
Operating Mode ASYNCHRONOUS ASYNCHRONOUS
Operating Temperature-Max 75 °C 70 °C
Operating Temperature-Min
Organization 128KX8 512X4
Output Characteristics 3-STATE OPEN-COLLECTOR
Package Body Material PLASTIC/EPOXY CERAMIC, GLASS-SEALED
Package Code DIP DIP
Package Equivalence Code DIP16,.3 DIP16,.3
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE IN-LINE
Parallel/Serial PARALLEL PARALLEL
Qualification Status Not Qualified Not Qualified
Seated Height-Max 5.08 mm 5.08 mm
Supply Current-Max 0.13 mA 0.13 mA
Supply Voltage-Max (Vsup) 5.5 V 5.25 V
Supply Voltage-Min (Vsup) 4.5 V 4.75 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount NO NO
Technology BIPOLAR BIPOLAR
Temperature Grade COMMERCIAL EXTENDED COMMERCIAL
Terminal Finish TIN LEAD Tin/Lead (Sn/Pb)
Terminal Form THROUGH-HOLE THROUGH-HOLE
Terminal Pitch 2.54 mm 2.54 mm
Terminal Position DUAL DUAL
Width 7.62 mm 7.62 mm
Base Number Matches 4 3

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Compare DM74S570J with alternatives