AM27S03DC
vs
S82S25F
feature comparison
All Stats
Differences Only
Part Life Cycle Code
Active
Obsolete
Ihs Manufacturer
ROCHESTER ELECTRONICS LLC
SIGNETICS CORP
Package Description
DIP,
,
Reach Compliance Code
unknown
unknown
ECCN Code
EAR99
3A001.A.2.C
HTS Code
8542.32.00.41
8542.32.00.41
Access Time-Max
35 ns
60 ns
I/O Type
COMMON
JESD-30 Code
R-CDIP-T16
R-GDIP-T16
Memory Density
64 bit
64 bit
Memory IC Type
STANDARD SRAM
STANDARD SRAM
Memory Width
4
4
Number of Functions
1
1
Number of Ports
1
1
Number of Terminals
16
16
Number of Words
16 words
16 words
Number of Words Code
16
16
Operating Mode
ASYNCHRONOUS
ASYNCHRONOUS
Operating Temperature-Max
75 °C
125 °C
Operating Temperature-Min
-55 °C
Organization
16X4
16X4
Output Characteristics
3-STATE
Output Enable
NO
NO
Package Body Material
CERAMIC, METAL-SEALED COFIRED
CERAMIC, GLASS-SEALED
Package Code
DIP
DIP
Package Equivalence Code
DIP16,.3
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
IN-LINE
IN-LINE
Parallel/Serial
PARALLEL
PARALLEL
Peak Reflow Temperature (Cel)
NOT SPECIFIED
Supply Current-Max
0.07 mA
Supply Voltage-Max (Vsup)
5.25 V
5.5 V
Supply Voltage-Min (Vsup)
4.75 V
4.5 V
Supply Voltage-Nom (Vsup)
5 V
5 V
Surface Mount
NO
NO
Technology
BIPOLAR
TTL
Temperature Grade
COMMERCIAL EXTENDED
MILITARY
Terminal Form
THROUGH-HOLE
THROUGH-HOLE
Terminal Position
DUAL
DUAL
Time@Peak Reflow Temperature-Max (s)
NOT SPECIFIED
Base Number Matches
2
3
Qualification Status
Not Qualified
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