AM27PS281LC
vs
AM27S181/BUC
feature comparison
All Stats
Differences Only
Pbfree Code
Rohs Code
Part Life Cycle Code
Obsolete
Active
Ihs Manufacturer
ADVANCED MICRO DEVICES INC
ROCHESTER ELECTRONICS LLC
Part Package Code
QFJ
Package Description
QCCN,
QCCN,
Pin Count
32
Reach Compliance Code
unknown
unknown
ECCN Code
EAR99
EAR99
HTS Code
8542.32.00.71
8542.32.00.71
Access Time-Max
40 ns
80 ns
JESD-30 Code
R-CQCC-N32
R-CQCC-N32
Length
13.97 mm
13.97 mm
Memory Density
8192 bit
8192 bit
Memory IC Type
OTP ROM
OTP ROM
Memory Width
8
8
Number of Functions
1
1
Number of Terminals
32
32
Number of Words
1024 words
1024 words
Number of Words Code
32
1000
Operating Mode
ASYNCHRONOUS
ASYNCHRONOUS
Operating Temperature-Max
75 °C
125 °C
Operating Temperature-Min
-55 °C
Organization
1KX8
1KX8
Output Characteristics
3-STATE
Package Body Material
CERAMIC, METAL-SEALED COFIRED
CERAMIC, METAL-SEALED COFIRED
Package Code
QCCN
QCCN
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
CHIP CARRIER
CHIP CARRIER
Parallel/Serial
PARALLEL
PARALLEL
Peak Reflow Temperature (Cel)
NOT SPECIFIED
Qualification Status
Not Qualified
Seated Height-Max
2.54 mm
2.54 mm
Supply Current-Max
0.115 mA
Supply Voltage-Nom (Vsup)
5 V
5 V
Surface Mount
YES
YES
Technology
BIPOLAR
BIPOLAR
Temperature Grade
COMMERCIAL EXTENDED
MILITARY
Terminal Form
NO LEAD
NO LEAD
Terminal Pitch
1.27 mm
1.27 mm
Terminal Position
QUAD
QUAD
Time@Peak Reflow Temperature-Max (s)
NOT SPECIFIED
Width
11.43 mm
11.43 mm
Base Number Matches
1
2
JESD-609 Code
e0
Supply Voltage-Max (Vsup)
5.5 V
Supply Voltage-Min (Vsup)
4.5 V
Terminal Finish
TIN LEAD
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