AM27LV010B-250JI
vs
AT27C010-55TC
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
ADVANCED MICRO DEVICES INC
ATMEL CORP
Part Package Code
QFJ
TSOP1
Package Description
QCCJ, LDCC32,.5X.6
PLASTIC, MO-142BD, TSOP-32
Pin Count
32
32
Reach Compliance Code
unknown
unknown
ECCN Code
EAR99
EAR99
HTS Code
8542.32.00.71
8542.32.00.71
Access Time-Max
250 ns
55 ns
I/O Type
COMMON
COMMON
JESD-30 Code
R-PQCC-J32
R-PDSO-G32
JESD-609 Code
e0
e0
Length
13.97 mm
18.4 mm
Memory Density
1048576 bit
1048576 bit
Memory IC Type
OTP ROM
OTP ROM
Memory Width
8
8
Number of Functions
1
1
Number of Terminals
32
32
Number of Words
131072 words
131072 words
Number of Words Code
128000
128000
Operating Mode
ASYNCHRONOUS
ASYNCHRONOUS
Operating Temperature-Max
85 °C
70 °C
Operating Temperature-Min
-40 °C
Organization
128KX8
128KX8
Output Characteristics
3-STATE
3-STATE
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
QCCJ
TSOP1
Package Equivalence Code
LDCC32,.5X.6
TSSOP32,.8,20
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
CHIP CARRIER
SMALL OUTLINE, THIN PROFILE
Parallel/Serial
PARALLEL
PARALLEL
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
3.556 mm
1.2 mm
Standby Current-Max
0.000025 A
0.00001 A
Supply Current-Max
0.015 mA
0.035 mA
Supply Voltage-Max (Vsup)
3.6 V
5.5 V
Supply Voltage-Min (Vsup)
2.7 V
4.5 V
Supply Voltage-Nom (Vsup)
3.3 V
5 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
INDUSTRIAL
COMMERCIAL
Terminal Finish
Tin/Lead (Sn/Pb)
TIN LEAD
Terminal Form
J BEND
GULL WING
Terminal Pitch
1.27 mm
0.5 mm
Terminal Position
QUAD
DUAL
Width
11.43 mm
8 mm
Base Number Matches
1
2
Moisture Sensitivity Level
3
Peak Reflow Temperature (Cel)
240
Compare AM27LV010B-250JI with alternatives
Compare AT27C010-55TC with alternatives