AM27LV010B-250JC
vs
AM27H010-70LE
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
ADVANCED MICRO DEVICES INC
ADVANCED MICRO DEVICES INC
Part Package Code
QFJ
QFJ
Package Description
QCCJ, LDCC32,.5X.6
WQCCN, LCC32,.45X.55
Pin Count
32
32
Reach Compliance Code
unknown
unknown
ECCN Code
EAR99
3A001.A.2.C
HTS Code
8542.32.00.71
8542.32.00.61
Access Time-Max
250 ns
70 ns
I/O Type
COMMON
COMMON
JESD-30 Code
R-PQCC-J32
R-CQCC-N32
JESD-609 Code
e0
e0
Length
13.97 mm
13.97 mm
Memory Density
1048576 bit
1048576 bit
Memory IC Type
OTP ROM
UVPROM
Memory Width
8
8
Number of Functions
1
1
Number of Terminals
32
32
Number of Words
131072 words
131072 words
Number of Words Code
128000
128000
Operating Mode
ASYNCHRONOUS
ASYNCHRONOUS
Operating Temperature-Max
70 °C
125 °C
Operating Temperature-Min
-55 °C
Organization
128KX8
128KX8
Output Characteristics
3-STATE
3-STATE
Package Body Material
PLASTIC/EPOXY
CERAMIC, METAL-SEALED COFIRED
Package Code
QCCJ
WQCCN
Package Equivalence Code
LDCC32,.5X.6
LCC32,.45X.55
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
CHIP CARRIER
CHIP CARRIER, WINDOW
Parallel/Serial
PARALLEL
PARALLEL
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
3.556 mm
3.556 mm
Standby Current-Max
0.000025 A
0.035 A
Supply Current-Max
0.015 mA
0.06 mA
Supply Voltage-Max (Vsup)
3.6 V
5.5 V
Supply Voltage-Min (Vsup)
2.7 V
4.5 V
Supply Voltage-Nom (Vsup)
3.3 V
5 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
COMMERCIAL
MILITARY
Terminal Finish
Tin/Lead (Sn/Pb)
Tin/Lead (Sn/Pb)
Terminal Form
J BEND
NO LEAD
Terminal Pitch
1.27 mm
1.27 mm
Terminal Position
QUAD
QUAD
Width
11.43 mm
11.43 mm
Base Number Matches
1
1
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Compare AM27H010-70LE with alternatives