AM27LV010B-200LE vs AM27LV010B-250EC feature comparison

AM27LV010B-200LE AMD

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AM27LV010B-250EC AMD

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Rohs Code No No
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer ADVANCED MICRO DEVICES INC ADVANCED MICRO DEVICES INC
Part Package Code QFJ TSOP
Package Description WQCCN, LCC32,.45X.55 TSOP1, TSSOP32,.8,20
Pin Count 32 32
Reach Compliance Code unknown unknown
ECCN Code 3A001.A.2.C EAR99
HTS Code 8542.32.00.61 8542.32.00.71
Access Time-Max 200 ns 250 ns
I/O Type COMMON COMMON
JESD-30 Code R-CQCC-N32 R-PDSO-G32
JESD-609 Code e0 e0
Length 13.97 mm 18.4 mm
Memory Density 1048576 bit 1048576 bit
Memory IC Type UVPROM OTP ROM
Memory Width 8 8
Number of Functions 1 1
Number of Terminals 32 32
Number of Words 131072 words 131072 words
Number of Words Code 128000 128000
Operating Mode ASYNCHRONOUS ASYNCHRONOUS
Operating Temperature-Max 125 °C 70 °C
Operating Temperature-Min -55 °C
Organization 128KX8 128KX8
Output Characteristics 3-STATE 3-STATE
Package Body Material CERAMIC, METAL-SEALED COFIRED PLASTIC/EPOXY
Package Code WQCCN TSOP1
Package Equivalence Code LCC32,.45X.55 TSSOP32,.8,20
Package Shape RECTANGULAR RECTANGULAR
Package Style CHIP CARRIER, WINDOW SMALL OUTLINE, THIN PROFILE
Parallel/Serial PARALLEL PARALLEL
Qualification Status Not Qualified Not Qualified
Seated Height-Max 3.556 mm 1.2 mm
Standby Current-Max 0.000025 A 0.000025 A
Supply Current-Max 0.02 mA 0.015 mA
Supply Voltage-Max (Vsup) 3.6 V 3.6 V
Supply Voltage-Min (Vsup) 2.7 V 2.7 V
Supply Voltage-Nom (Vsup) 3.3 V 3.3 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade MILITARY COMMERCIAL
Terminal Finish Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb)
Terminal Form NO LEAD GULL WING
Terminal Pitch 1.27 mm 0.5 mm
Terminal Position QUAD DUAL
Width 11.43 mm 8 mm
Base Number Matches 1 1

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Compare AM27LV010B-250EC with alternatives