AM27LV010-300/BXA vs AT27LV010A-90VI feature comparison

AM27LV010-300/BXA AMD

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AT27LV010A-90VI Atmel Corporation

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Rohs Code No No
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer ADVANCED MICRO DEVICES INC ATMEL CORP
Part Package Code DIP TSOP
Package Description WDIP, DIP32,.6 8 X 14 MM, PLASTIC, TSOP-32
Pin Count 32 32
Reach Compliance Code unknown compliant
ECCN Code 3A001.A.2.C EAR99
HTS Code 8542.32.00.61 8542.32.00.71
Access Time-Max 300 ns 90 ns
I/O Type COMMON COMMON
JESD-30 Code R-GDIP-T32 R-PDSO-G32
JESD-609 Code e0 e0
Length 42.1005 mm 12.4 mm
Memory Density 1048576 bit 1048576 bit
Memory IC Type UVPROM OTP ROM
Memory Width 8 8
Number of Functions 1 1
Number of Terminals 32 32
Number of Words 131072 words 131072 words
Number of Words Code 128000 128000
Operating Mode ASYNCHRONOUS ASYNCHRONOUS
Operating Temperature-Max 125 °C 85 °C
Operating Temperature-Min -55 °C -40 °C
Organization 128KX8 128KX8
Output Characteristics 3-STATE 3-STATE
Package Body Material CERAMIC, GLASS-SEALED PLASTIC/EPOXY
Package Code WDIP TSOP1
Package Equivalence Code DIP32,.6 TSSOP32,.56,20
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE, WINDOW SMALL OUTLINE, THIN PROFILE
Parallel/Serial PARALLEL PARALLEL
Qualification Status Not Qualified Not Qualified
Screening Level 38535Q/M;38534H;883B
Seated Height-Max 5.588 mm 1.2 mm
Standby Current-Max 0.000025 A 0.00001 A
Supply Current-Max 0.02 mA 0.025 mA
Supply Voltage-Max (Vsup) 3.6 V 3.6 V
Supply Voltage-Min (Vsup) 3 V 3 V
Supply Voltage-Nom (Vsup) 3.3 V 3.3 V
Surface Mount NO YES
Technology CMOS CMOS
Temperature Grade MILITARY INDUSTRIAL
Terminal Finish Tin/Lead (Sn/Pb) TIN LEAD
Terminal Form THROUGH-HOLE GULL WING
Terminal Pitch 2.54 mm 0.5 mm
Terminal Position DUAL DUAL
Width 15.24 mm 8 mm
Base Number Matches 1 1
Additional Feature CAN ALSO BE OPERATED AT 4.5V TO 5.5V RANGE

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