AM27LV010-200LEB
vs
NM27LV010C200
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
ADVANCED MICRO DEVICES INC
NATIONAL SEMICONDUCTOR CORP
Part Package Code
QFJ
QFJ
Package Description
WQCCN, LCC32,.45X.55
WQCCN,
Pin Count
32
32
Reach Compliance Code
unknown
unknown
ECCN Code
3A001.A.2.C
EAR99
HTS Code
8542.32.00.61
8542.32.00.61
Access Time-Max
200 ns
200 ns
I/O Type
COMMON
JESD-30 Code
R-CQCC-N32
R-CQCC-N32
JESD-609 Code
e0
Length
13.97 mm
13.97 mm
Memory Density
1048576 bit
1048576 bit
Memory IC Type
UVPROM
UVPROM
Memory Width
8
8
Number of Functions
1
1
Number of Terminals
32
32
Number of Words
131072 words
131072 words
Number of Words Code
128000
128000
Operating Mode
ASYNCHRONOUS
ASYNCHRONOUS
Operating Temperature-Max
125 °C
70 °C
Operating Temperature-Min
-55 °C
Organization
128KX8
128KX8
Output Characteristics
3-STATE
3-STATE
Package Body Material
CERAMIC, METAL-SEALED COFIRED
CERAMIC, METAL-SEALED COFIRED
Package Code
WQCCN
WQCCN
Package Equivalence Code
LCC32,.45X.55
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
CHIP CARRIER, WINDOW
CHIP CARRIER, WINDOW
Parallel/Serial
PARALLEL
PARALLEL
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
3.556 mm
3.09 mm
Standby Current-Max
0.000025 A
Supply Current-Max
0.02 mA
0.008 mA
Supply Voltage-Max (Vsup)
3.6 V
3.6 V
Supply Voltage-Min (Vsup)
3 V
3 V
Supply Voltage-Nom (Vsup)
3.3 V
3.3 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
MILITARY
COMMERCIAL
Terminal Finish
Tin/Lead (Sn/Pb)
Terminal Form
NO LEAD
NO LEAD
Terminal Pitch
1.27 mm
1.27 mm
Terminal Position
QUAD
QUAD
Width
11.43 mm
11.43 mm
Base Number Matches
1
1
Compare AM27LV010-200LEB with alternatives
Compare NM27LV010C200 with alternatives