AM27LS03-55DCB vs AM27LS03-30/BEA feature comparison

AM27LS03-55DCB AMD

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AM27LS03-30/BEA Rochester Electronics LLC

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Rohs Code No
Part Life Cycle Code Obsolete Active
Ihs Manufacturer ADVANCED MICRO DEVICES INC ROCHESTER ELECTRONICS LLC
Part Package Code DIP
Package Description DIP, DIP16,.3 ,
Pin Count 16
Reach Compliance Code unknown unknown
ECCN Code EAR99 EAR99
HTS Code 8542.32.00.41 8542.32.00.41
Access Time-Max 55 ns
JESD-30 Code R-CDIP-T16
JESD-609 Code e0
Length 19.6215 mm
Memory Density 64 bit
Memory IC Type STANDARD SRAM STANDARD SRAM
Memory Width 4
Number of Functions 1
Number of Terminals 16
Number of Words 16 words
Number of Words Code 16
Operating Mode ASYNCHRONOUS
Operating Temperature-Max 75 °C
Operating Temperature-Min
Organization 16X4
Output Characteristics 3-STATE
Package Body Material CERAMIC, METAL-SEALED COFIRED
Package Code DIP
Package Equivalence Code DIP16,.3
Package Shape RECTANGULAR
Package Style IN-LINE
Parallel/Serial PARALLEL
Qualification Status Not Qualified
Seated Height-Max 5.08 mm
Supply Voltage-Max (Vsup) 5.25 V
Supply Voltage-Min (Vsup) 4.75 V
Supply Voltage-Nom (Vsup) 5 V
Surface Mount NO
Technology BIPOLAR
Temperature Grade COMMERCIAL EXTENDED
Terminal Finish TIN LEAD
Terminal Form THROUGH-HOLE
Terminal Pitch 2.54 mm
Terminal Position DUAL
Width 7.62 mm
Base Number Matches 1 1
Peak Reflow Temperature (Cel) NOT SPECIFIED
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED

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Compare AM27LS03-30/BEA with alternatives