AM27LS02-65/BFA
vs
74F219FC
feature comparison
All Stats
Differences Only
Rohs Code
No
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
ADVANCED MICRO DEVICES INC
NATIONAL SEMICONDUCTOR CORP
Part Package Code
DFP
DFP
Package Description
DFP, FL16,.3
DFP,
Pin Count
16
16
Reach Compliance Code
unknown
unknown
ECCN Code
3A001.A.2.C
EAR99
HTS Code
8542.32.00.41
8542.32.00.41
Access Time-Max
65 ns
27 ns
Additional Feature
WD-MAX
JESD-30 Code
R-CDFP-F16
R-GDFP-F16
JESD-609 Code
e0
Length
10.16 mm
9.6645 mm
Memory Density
64 bit
64 bit
Memory IC Type
STANDARD SRAM
STANDARD SRAM
Memory Width
4
4
Number of Functions
1
1
Number of Terminals
16
16
Number of Words
16 words
16 words
Number of Words Code
16
16
Operating Mode
ASYNCHRONOUS
ASYNCHRONOUS
Operating Temperature-Max
125 °C
70 °C
Operating Temperature-Min
-55 °C
Organization
16X4
16X4
Output Characteristics
OPEN-COLLECTOR
3-STATE
Package Body Material
CERAMIC, METAL-SEALED COFIRED
CERAMIC, GLASS-SEALED
Package Code
DFP
DFP
Package Equivalence Code
FL16,.3
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
FLATPACK
FLATPACK
Parallel/Serial
PARALLEL
PARALLEL
Qualification Status
Not Qualified
Not Qualified
Screening Level
38535Q/M;38534H;883B
Seated Height-Max
2.159 mm
2.032 mm
Supply Voltage-Max (Vsup)
5.5 V
5.5 V
Supply Voltage-Min (Vsup)
4.5 V
4.5 V
Supply Voltage-Nom (Vsup)
5 V
5 V
Surface Mount
YES
YES
Technology
BIPOLAR
TTL
Temperature Grade
MILITARY
COMMERCIAL
Terminal Finish
TIN LEAD
Terminal Form
FLAT
FLAT
Terminal Pitch
1.27 mm
1.27 mm
Terminal Position
DUAL
DUAL
Width
7.747 mm
6.604 mm
Base Number Matches
1
1
Number of Ports
1
Output Enable
NO
Compare AM27LS02-65/BFA with alternatives
Compare 74F219FC with alternatives