AM27H010-45DCB vs AM27LV010-200LE feature comparison

AM27H010-45DCB AMD

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AM27LV010-200LE AMD

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Rohs Code No No
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer ADVANCED MICRO DEVICES INC ADVANCED MICRO DEVICES INC
Part Package Code DIP QFJ
Package Description WDIP, DIP32,.6 WQCCN, LCC32,.45X.55
Pin Count 32 32
Reach Compliance Code unknown unknown
ECCN Code EAR99 3A001.A.2.C
HTS Code 8542.32.00.61 8542.32.00.61
Access Time-Max 45 ns 200 ns
I/O Type COMMON COMMON
JESD-30 Code R-GDIP-T32 R-CQCC-N32
JESD-609 Code e0 e0
Length 42.1005 mm 13.97 mm
Memory Density 1048576 bit 1048576 bit
Memory IC Type UVPROM UVPROM
Memory Width 8 8
Number of Functions 1 1
Number of Terminals 32 32
Number of Words 131072 words 131072 words
Number of Words Code 128000 128000
Operating Mode ASYNCHRONOUS ASYNCHRONOUS
Operating Temperature-Max 70 °C 125 °C
Operating Temperature-Min -55 °C
Organization 128KX8 128KX8
Output Characteristics 3-STATE 3-STATE
Package Body Material CERAMIC, GLASS-SEALED CERAMIC, METAL-SEALED COFIRED
Package Code WDIP WQCCN
Package Equivalence Code DIP32,.6 LCC32,.45X.55
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE, WINDOW CHIP CARRIER, WINDOW
Parallel/Serial PARALLEL PARALLEL
Qualification Status Not Qualified Not Qualified
Seated Height-Max 5.588 mm 3.556 mm
Standby Current-Max 0.025 A 0.000025 A
Supply Current-Max 0.05 mA 0.02 mA
Supply Voltage-Max (Vsup) 5.5 V 3.6 V
Supply Voltage-Min (Vsup) 4.5 V 3 V
Supply Voltage-Nom (Vsup) 5 V 3.3 V
Surface Mount NO YES
Technology CMOS CMOS
Temperature Grade COMMERCIAL MILITARY
Terminal Finish Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb)
Terminal Form THROUGH-HOLE NO LEAD
Terminal Pitch 2.54 mm 1.27 mm
Terminal Position DUAL QUAD
Width 15.24 mm 11.43 mm
Base Number Matches 1 2

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