AM27C64-255DE vs MBM27C64-25-XZ feature comparison

AM27C64-255DE AMD

Buy Now Datasheet

MBM27C64-25-XZ FUJITSU Limited

Buy Now Datasheet
Rohs Code No
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer ADVANCED MICRO DEVICES INC FUJITSU SEMICONDUCTOR AMERICA INC
Part Package Code DIP DIP
Package Description WDIP, DIP28,.6 WDIP,
Pin Count 28 28
Reach Compliance Code unknown unknown
ECCN Code 3A001.A.2.C EAR99
HTS Code 8542.32.00.61 8542.32.00.61
Access Time-Max 250 ns 250 ns
I/O Type COMMON
JESD-30 Code R-GDIP-T28 R-GDIP-T28
JESD-609 Code e0
Length 37.1475 mm 37.275 mm
Memory Density 65536 bit 65536 bit
Memory IC Type UVPROM UVPROM
Memory Width 8 8
Number of Functions 1 1
Number of Terminals 28 28
Number of Words 8192 words 8192 words
Number of Words Code 8000 8000
Operating Mode ASYNCHRONOUS ASYNCHRONOUS
Operating Temperature-Max 125 °C 85 °C
Operating Temperature-Min -55 °C -40 °C
Organization 8KX8 8KX8
Output Characteristics 3-STATE 3-STATE
Package Body Material CERAMIC, GLASS-SEALED CERAMIC, GLASS-SEALED
Package Code WDIP WDIP
Package Equivalence Code DIP28,.6
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE, WINDOW IN-LINE, WINDOW
Parallel/Serial PARALLEL PARALLEL
Programming Voltage 12.75 V
Qualification Status Not Qualified Not Qualified
Seated Height-Max 5.588 mm 5.84 mm
Standby Current-Max 0.00012 A
Supply Current-Max 0.03 mA 0.03 mA
Supply Voltage-Max (Vsup) 5.25 V 5.5 V
Supply Voltage-Min (Vsup) 4.75 V 4.5 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount NO NO
Technology CMOS CMOS
Temperature Grade MILITARY INDUSTRIAL
Terminal Finish Tin/Lead (Sn/Pb)
Terminal Form THROUGH-HOLE THROUGH-HOLE
Terminal Pitch 2.54 mm 2.54 mm
Terminal Position DUAL DUAL
Width 15.24 mm 15.24 mm
Base Number Matches 1 2

Compare AM27C64-255DE with alternatives

Compare MBM27C64-25-XZ with alternatives