AM27C64-250JC
vs
27LV64-25/L
feature comparison
All Stats
Differences Only
Pbfree Code
Rohs Code
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
ADVANCED MICRO DEVICES INC
MICROCHIP TECHNOLOGY INC
Part Package Code
QFJ
QFJ
Package Description
QCCJ, LCC32,.45X.55
PLASTIC, LCC-32
Pin Count
32
32
Reach Compliance Code
unknown
unknown
ECCN Code
EAR99
EAR99
HTS Code
8542.32.00.71
8542.32.00.71
Access Time-Max
250 ns
250 ns
I/O Type
COMMON
COMMON
JESD-30 Code
R-PQCC-J32
R-PQCC-J32
Length
13.97 mm
13.97 mm
Memory Density
65536 bit
65536 bit
Memory IC Type
OTP ROM
OTP ROM
Memory Width
8
8
Number of Functions
1
1
Number of Terminals
32
32
Number of Words
8192 words
8192 words
Number of Words Code
8000
8000
Operating Mode
ASYNCHRONOUS
ASYNCHRONOUS
Operating Temperature-Max
70 °C
70 °C
Operating Temperature-Min
Organization
8KX8
8KX8
Output Characteristics
3-STATE
3-STATE
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
QCCJ
QCCJ
Package Equivalence Code
LCC32,.45X.55
LDCC32,.5X.6
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
CHIP CARRIER
CHIP CARRIER
Parallel/Serial
PARALLEL
PARALLEL
Peak Reflow Temperature (Cel)
NOT SPECIFIED
Programming Voltage
5 V
13 V
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
3.556 mm
3.56 mm
Standby Current-Max
0.0001 A
0.0001 A
Supply Current-Max
0.03 mA
0.025 mA
Supply Voltage-Max (Vsup)
5.5 V
5.5 V
Supply Voltage-Min (Vsup)
4.5 V
3 V
Supply Voltage-Nom (Vsup)
5 V
5 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
COMMERCIAL
COMMERCIAL
Terminal Form
J BEND
J BEND
Terminal Pitch
1.27 mm
1.27 mm
Terminal Position
QUAD
QUAD
Time@Peak Reflow Temperature-Max (s)
NOT SPECIFIED
Width
11.43 mm
11.43 mm
Base Number Matches
1
1
JESD-609 Code
e0
Terminal Finish
TIN LEAD
Compare AM27C64-250JC with alternatives
Compare 27LV64-25/L with alternatives