AM27C64-150DCB
vs
HY27UF084G2-TPIB
feature comparison
| Part Life Cycle Code |
Contact Manufacturer
|
Obsolete
|
| Ihs Manufacturer |
ROCHESTER ELECTRONICS LLC
|
SK HYNIX INC
|
| Package Description |
DIP,
|
TSOP1,
|
| Reach Compliance Code |
unknown
|
unknown
|
| ECCN Code |
EAR99
|
EAR99
|
| HTS Code |
8542.32.00.61
|
8542.32.00.51
|
| Access Time-Max |
150 ns
|
|
| JESD-30 Code |
R-CDIP-T28
|
R-PDSO-G48
|
| Memory Density |
65536 bit
|
4294967296 bit
|
| Memory IC Type |
UVPROM
|
FLASH
|
| Memory Width |
8
|
8
|
| Number of Functions |
1
|
1
|
| Number of Terminals |
28
|
48
|
| Number of Words |
8192 words
|
536870912 words
|
| Number of Words Code |
8000
|
512000000
|
| Operating Mode |
ASYNCHRONOUS
|
SYNCHRONOUS
|
| Operating Temperature-Max |
70 °C
|
85 °C
|
| Operating Temperature-Min |
|
-40 °C
|
| Organization |
8KX8
|
512MX8
|
| Package Body Material |
CERAMIC, METAL-SEALED COFIRED
|
PLASTIC/EPOXY
|
| Package Code |
DIP
|
TSOP1
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
IN-LINE
|
SMALL OUTLINE
|
| Parallel/Serial |
PARALLEL
|
PARALLEL
|
| Supply Current-Max |
0.025 mA
|
|
| Supply Voltage-Max (Vsup) |
5.5 V
|
3.6 V
|
| Supply Voltage-Min (Vsup) |
4.5 V
|
2.7 V
|
| Supply Voltage-Nom (Vsup) |
5 V
|
3.3 V
|
| Surface Mount |
NO
|
YES
|
| Technology |
CMOS
|
CMOS
|
| Temperature Grade |
COMMERCIAL
|
INDUSTRIAL
|
| Terminal Form |
THROUGH-HOLE
|
GULL WING
|
| Terminal Position |
DUAL
|
DUAL
|
| Base Number Matches |
1
|
1
|
| Part Package Code |
|
TSOP1
|
| Pin Count |
|
48
|
| Length |
|
18.4 mm
|
| Programming Voltage |
|
3.3 V
|
| Qualification Status |
|
Not Qualified
|
| Seated Height-Max |
|
1.2 mm
|
| Terminal Pitch |
|
0.5 mm
|
| Type |
|
SLC NAND TYPE
|
| Width |
|
12 mm
|
|
|
|
Compare AM27C64-150DCB with alternatives
Compare HY27UF084G2-TPIB with alternatives