AM27C512-305LI
vs
AM27C512-300LEB
feature comparison
Rohs Code |
No
|
|
Part Life Cycle Code |
Obsolete
|
Contact Manufacturer
|
Ihs Manufacturer |
ADVANCED MICRO DEVICES INC
|
ROCHESTER ELECTRONICS LLC
|
Part Package Code |
QFJ
|
|
Package Description |
WQCCN, LCC32,.45X.55
|
QCCN,
|
Pin Count |
32
|
|
Reach Compliance Code |
unknown
|
unknown
|
ECCN Code |
EAR99
|
3A001.A.2.C
|
HTS Code |
8542.32.00.61
|
8542.32.00.61
|
Access Time-Max |
300 ns
|
300 ns
|
I/O Type |
COMMON
|
|
JESD-30 Code |
R-CQCC-N32
|
R-CQCC-N32
|
JESD-609 Code |
e0
|
|
Length |
13.97 mm
|
13.97 mm
|
Memory Density |
524288 bit
|
524288 bit
|
Memory IC Type |
UVPROM
|
UVPROM
|
Memory Width |
8
|
8
|
Number of Functions |
1
|
1
|
Number of Terminals |
32
|
32
|
Number of Words |
65536 words
|
65536 words
|
Number of Words Code |
64000
|
64000
|
Operating Mode |
ASYNCHRONOUS
|
ASYNCHRONOUS
|
Operating Temperature-Max |
85 °C
|
125 °C
|
Operating Temperature-Min |
-40 °C
|
-55 °C
|
Organization |
64KX8
|
64KX8
|
Output Characteristics |
3-STATE
|
|
Package Body Material |
CERAMIC, METAL-SEALED COFIRED
|
CERAMIC, METAL-SEALED COFIRED
|
Package Code |
WQCCN
|
QCCN
|
Package Equivalence Code |
LCC32,.45X.55
|
|
Package Shape |
RECTANGULAR
|
RECTANGULAR
|
Package Style |
CHIP CARRIER, WINDOW
|
CHIP CARRIER
|
Parallel/Serial |
PARALLEL
|
PARALLEL
|
Qualification Status |
Not Qualified
|
|
Seated Height-Max |
3.556 mm
|
3.556 mm
|
Standby Current-Max |
0.0001 A
|
|
Supply Current-Max |
0.04 mA
|
0.05 mA
|
Supply Voltage-Max (Vsup) |
5.25 V
|
5.5 V
|
Supply Voltage-Min (Vsup) |
4.75 V
|
4.5 V
|
Supply Voltage-Nom (Vsup) |
5 V
|
5 V
|
Surface Mount |
YES
|
YES
|
Technology |
CMOS
|
CMOS
|
Temperature Grade |
INDUSTRIAL
|
MILITARY
|
Terminal Finish |
Tin/Lead (Sn/Pb)
|
|
Terminal Form |
NO LEAD
|
NO LEAD
|
Terminal Pitch |
1.27 mm
|
1.27 mm
|
Terminal Position |
QUAD
|
QUAD
|
Width |
11.43 mm
|
11.43 mm
|
Base Number Matches |
2
|
2
|
|
|
|
Compare AM27C512-305LI with alternatives