AM27C512-150JC vs M27C512-20XC3X feature comparison

AM27C512-150JC Spansion

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M27C512-20XC3X STMicroelectronics

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Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer SPANSION INC STMICROELECTRONICS
Part Package Code QFJ QFJ
Package Description QCCJ, PLASTIC, LCC-32
Pin Count 32 32
Reach Compliance Code unknown unknown
ECCN Code EAR99 EAR99
HTS Code 8542.32.00.71 8542.32.00.71
Access Time-Max 35 ns 150 ns
JESD-30 Code R-PQCC-J32 R-PQCC-J32
Length 13.97 mm 13.995 mm
Memory Density 1048576 bit 524288 bit
Memory IC Type OTP ROM OTP ROM
Memory Width 16 8
Number of Functions 1 1
Number of Terminals 32 32
Number of Words 65536 words 65536 words
Number of Words Code 64000 64000
Operating Mode ASYNCHRONOUS ASYNCHRONOUS
Operating Temperature-Max 70 °C 125 °C
Operating Temperature-Min -40 °C
Organization 64KX16 64KX8
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code QCCJ QCCJ
Package Shape RECTANGULAR RECTANGULAR
Package Style CHIP CARRIER CHIP CARRIER
Parallel/Serial PARALLEL PARALLEL
Qualification Status Not Qualified Not Qualified
Seated Height-Max 3.556 mm 3.56 mm
Supply Current-Max 0.025 mA 0.03 mA
Supply Voltage-Max (Vsup) 5.25 V 5.25 V
Supply Voltage-Min (Vsup) 4.75 V 4.75 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade COMMERCIAL AUTOMOTIVE
Terminal Form J BEND J BEND
Terminal Pitch 1.27 mm 1.27 mm
Terminal Position QUAD QUAD
Width 11.43 mm 11.455 mm
Base Number Matches 3 1
Rohs Code No
I/O Type COMMON
Output Characteristics 3-STATE
Package Equivalence Code LDCC32,.5X.6
Peak Reflow Temperature (Cel) NOT SPECIFIED
Standby Current-Max 0.0001 A
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED

Compare AM27C512-150JC with alternatives

Compare M27C512-20XC3X with alternatives