AM27C512-120JI
vs
CY27C512-120JI
feature comparison
| Part Life Cycle Code |
Active
|
Obsolete
|
| Ihs Manufacturer |
ROCHESTER ELECTRONICS LLC
|
CYPRESS SEMICONDUCTOR CORP
|
| Package Description |
QCCJ,
|
QCCJ, LDCC32,.5X.6
|
| Reach Compliance Code |
unknown
|
not_compliant
|
| ECCN Code |
EAR99
|
EAR99
|
| HTS Code |
8542.32.00.71
|
8542.32.00.71
|
| Access Time-Max |
55 ns
|
120 ns
|
| JESD-30 Code |
R-PQCC-J32
|
R-PQCC-J32
|
| Length |
13.97 mm
|
|
| Memory Density |
8192 bit
|
524288 bit
|
| Memory IC Type |
OTP ROM
|
OTP ROM
|
| Memory Width |
8
|
8
|
| Number of Functions |
1
|
1
|
| Number of Terminals |
32
|
32
|
| Number of Words |
65536 words
|
65536 words
|
| Number of Words Code |
1000
|
64000
|
| Operating Mode |
ASYNCHRONOUS
|
ASYNCHRONOUS
|
| Operating Temperature-Max |
85 °C
|
85 °C
|
| Operating Temperature-Min |
-40 °C
|
-40 °C
|
| Organization |
1KX8
|
64KX8
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
QCCJ
|
QCCJ
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
CHIP CARRIER
|
CHIP CARRIER
|
| Parallel/Serial |
PARALLEL
|
PARALLEL
|
| Peak Reflow Temperature (Cel) |
NOT SPECIFIED
|
|
| Seated Height-Max |
3.55 mm
|
|
| Supply Current-Max |
0.025 mA
|
0.04 mA
|
| Supply Voltage-Max (Vsup) |
5.5 V
|
5.5 V
|
| Supply Voltage-Min (Vsup) |
4.5 V
|
4.5 V
|
| Supply Voltage-Nom (Vsup) |
5 V
|
5 V
|
| Surface Mount |
YES
|
YES
|
| Technology |
CMOS
|
CMOS
|
| Temperature Grade |
INDUSTRIAL
|
INDUSTRIAL
|
| Terminal Form |
J BEND
|
J BEND
|
| Terminal Pitch |
1.27 mm
|
1.27 mm
|
| Terminal Position |
QUAD
|
QUAD
|
| Time@Peak Reflow Temperature-Max (s) |
NOT SPECIFIED
|
|
| Width |
11.43 mm
|
|
| Base Number Matches |
3
|
1
|
| Rohs Code |
|
No
|
| Part Package Code |
|
QFJ
|
| Pin Count |
|
32
|
| I/O Type |
|
COMMON
|
| Output Characteristics |
|
3-STATE
|
| Package Equivalence Code |
|
LDCC32,.5X.6
|
| Qualification Status |
|
Not Qualified
|
| Standby Current-Max |
|
0.015 A
|
|
|
|
Compare CY27C512-120JI with alternatives