AM27C51-55DC vs AM27C128-200LEB feature comparison

AM27C51-55DC AMD

Buy Now Datasheet

AM27C128-200LEB AMD

Buy Now Datasheet
Pbfree Code No
Rohs Code No No
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer ADVANCED MICRO DEVICES INC ADVANCED MICRO DEVICES INC
Part Package Code DIP QFJ
Package Description WDIP, WQCCN, LCC32,.45X.55
Pin Count 28 32
Reach Compliance Code unknown unknown
ECCN Code EAR99 3A001.A.2.C
HTS Code 8542.32.00.61 8542.32.00.61
Access Time-Max 55 ns 200 ns
JESD-30 Code R-GDIP-T28 R-CQCC-N32
Length 37.1475 mm 13.97 mm
Memory Density 131072 bit 131072 bit
Memory IC Type UVPROM UVPROM
Memory Width 8 8
Number of Functions 1 1
Number of Terminals 28 32
Number of Words 16384 words 16384 words
Number of Words Code 16000 16000
Operating Mode ASYNCHRONOUS ASYNCHRONOUS
Operating Temperature-Max 75 °C 125 °C
Operating Temperature-Min -55 °C
Organization 16KX8 16KX8
Output Characteristics 3-STATE 3-STATE
Package Body Material CERAMIC, GLASS-SEALED CERAMIC, METAL-SEALED COFIRED
Package Code WDIP WQCCN
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE, WINDOW CHIP CARRIER, WINDOW
Parallel/Serial PARALLEL PARALLEL
Peak Reflow Temperature (Cel) NOT SPECIFIED
Qualification Status Not Qualified Not Qualified
Seated Height-Max 5.588 mm 3.556 mm
Supply Current-Max 0.09 mA 0.03 mA
Supply Voltage-Max (Vsup) 5.5 V 5.5 V
Supply Voltage-Min (Vsup) 4.5 V 4.5 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount NO YES
Technology CMOS CMOS
Temperature Grade COMMERCIAL EXTENDED MILITARY
Terminal Form THROUGH-HOLE NO LEAD
Terminal Pitch 2.54 mm 1.27 mm
Terminal Position DUAL QUAD
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED
Width 15.24 mm 11.43 mm
Base Number Matches 1 1
I/O Type COMMON
JESD-609 Code e0
Package Equivalence Code LCC32,.45X.55
Programming Voltage 12.75 V
Standby Current-Max 0.00012 A
Terminal Finish Tin/Lead (Sn/Pb)

Compare AM27C51-55DC with alternatives

Compare AM27C128-200LEB with alternatives