AM27C256-90EC vs 27LV256T-25/SO feature comparison

AM27C256-90EC AMD

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27LV256T-25/SO Microchip Technology Inc

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Rohs Code No
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer ADVANCED MICRO DEVICES INC MICROCHIP TECHNOLOGY INC
Part Package Code TSOP SOIC
Package Description TSOP1, TSSOP28/32,.8,20 0.300 INCH, PLASTIC, SOIC-28
Pin Count 32 28
Reach Compliance Code unknown unknown
ECCN Code EAR99 EAR99
HTS Code 8542.32.00.71 8542.32.00.71
Access Time-Max 90 ns 250 ns
I/O Type COMMON
JESD-30 Code R-PDSO-G32 R-PDSO-G28
JESD-609 Code e0
Length 18.4 mm 17.9 mm
Memory Density 262144 bit 262144 bit
Memory IC Type OTP ROM OTP ROM
Memory Width 8 8
Number of Functions 1 1
Number of Terminals 32 28
Number of Words 32768 words 32768 words
Number of Words Code 32000 32000
Operating Mode ASYNCHRONOUS ASYNCHRONOUS
Operating Temperature-Max 70 °C 70 °C
Operating Temperature-Min
Organization 32KX8 32KX8
Output Characteristics 3-STATE 3-STATE
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code TSOP1 SOP
Package Equivalence Code TSSOP28/32,.8,20
Package Shape RECTANGULAR RECTANGULAR
Package Style SMALL OUTLINE, THIN PROFILE SMALL OUTLINE
Parallel/Serial PARALLEL PARALLEL
Programming Voltage 12.75 V
Qualification Status Not Qualified Not Qualified
Seated Height-Max 1.2 mm 2.65 mm
Standby Current-Max 0.0001 A
Supply Current-Max 0.025 mA
Supply Voltage-Max (Vsup) 5.5 V 5.5 V
Supply Voltage-Min (Vsup) 4.5 V 3 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade COMMERCIAL COMMERCIAL
Terminal Finish Tin/Lead (Sn/Pb)
Terminal Form GULL WING GULL WING
Terminal Pitch 0.5 mm 1.27 mm
Terminal Position DUAL DUAL
Width 8 mm 7.5 mm
Base Number Matches 1 1

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