AM27C256-250DEB
vs
SMJ27C256-25JM
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Obsolete
Transferred
Ihs Manufacturer
ADVANCED MICRO DEVICES INC
TEXAS INSTRUMENTS INC
Part Package Code
DIP
DIP
Package Description
WDIP, DIP28,.6
0.600 INCH, SIDE BRAZED, CERAMIC, DIP-28
Pin Count
28
28
Reach Compliance Code
unknown
not_compliant
ECCN Code
3A001.A.2.C
3A001.A.2.C
HTS Code
8542.32.00.61
8542.32.00.61
Access Time-Max
250 ns
250 ns
I/O Type
COMMON
COMMON
JESD-30 Code
R-GDIP-T28
R-GDIP-T28
Length
37.1475 mm
36.83 mm
Memory Density
262144 bit
262144 bit
Memory IC Type
UVPROM
UVPROM
Memory Width
8
8
Number of Functions
1
1
Number of Terminals
28
28
Number of Words
32768 words
32768 words
Number of Words Code
32000
32000
Operating Mode
ASYNCHRONOUS
ASYNCHRONOUS
Operating Temperature-Max
125 °C
125 °C
Operating Temperature-Min
-55 °C
-55 °C
Organization
32KX8
32KX8
Output Characteristics
3-STATE
3-STATE
Package Body Material
CERAMIC, GLASS-SEALED
CERAMIC, GLASS-SEALED
Package Code
WDIP
WDIP
Package Equivalence Code
DIP28,.6
DIP28,.6
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
IN-LINE, WINDOW
IN-LINE, WINDOW
Parallel/Serial
PARALLEL
PARALLEL
Programming Voltage
12.75 V
12.5 V
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
5.588 mm
4.91 mm
Standby Current-Max
0.0001 A
0.0003 A
Supply Current-Max
0.05 mA
0.025 mA
Supply Voltage-Max (Vsup)
5.5 V
5.5 V
Supply Voltage-Min (Vsup)
4.5 V
4.5 V
Supply Voltage-Nom (Vsup)
5 V
5 V
Surface Mount
NO
NO
Technology
CMOS
CMOS
Temperature Grade
MILITARY
MILITARY
Terminal Form
THROUGH-HOLE
THROUGH-HOLE
Terminal Pitch
2.54 mm
2.54 mm
Terminal Position
DUAL
DUAL
Width
15.24 mm
15.24 mm
Base Number Matches
1
2
Peak Reflow Temperature (Cel)
NOT SPECIFIED
Screening Level
38535Q/M;38534H;883B
Time@Peak Reflow Temperature-Max (s)
NOT SPECIFIED
Compare AM27C256-250DEB with alternatives
Compare SMJ27C256-25JM with alternatives