AM27C256-200PI
vs
NMC27C256BN200
feature comparison
All Stats
Differences Only
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
SPANSION INC
NATIONAL SEMICONDUCTOR CORP
Part Package Code
DIP
Package Description
DIP-28
DIP, DIP28,.6
Pin Count
28
Reach Compliance Code
unknown
unknown
ECCN Code
EAR99
EAR99
HTS Code
8542.32.00.71
8542.32.00.71
Access Time-Max
80 ns
200 ns
JESD-30 Code
R-PDIP-T28
R-PDIP-T28
Length
37.084 mm
35.725 mm
Memory Density
1048576 bit
262144 bit
Memory IC Type
OTP ROM
OTP ROM
Memory Width
16
8
Number of Functions
1
1
Number of Terminals
28
28
Number of Words
32768 words
32768 words
Number of Words Code
64000
32000
Operating Mode
ASYNCHRONOUS
ASYNCHRONOUS
Operating Temperature-Max
85 °C
70 °C
Operating Temperature-Min
-40 °C
Organization
64KX16
32KX8
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
DIP
DIP
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
IN-LINE
IN-LINE
Parallel/Serial
PARALLEL
PARALLEL
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
5.715 mm
5.334 mm
Supply Current-Max
0.025 mA
0.03 mA
Supply Voltage-Max (Vsup)
5.25 V
5.5 V
Supply Voltage-Min (Vsup)
4.75 V
4.5 V
Supply Voltage-Nom (Vsup)
5 V
5 V
Surface Mount
NO
NO
Technology
CMOS
CMOS
Temperature Grade
INDUSTRIAL
COMMERCIAL
Terminal Form
THROUGH-HOLE
THROUGH-HOLE
Terminal Pitch
2.54 mm
2.54 mm
Terminal Position
DUAL
DUAL
Width
15.24 mm
15.24 mm
Base Number Matches
3
2
Rohs Code
I/O Type
COMMON
JESD-609 Code
e0
Output Characteristics
3-STATE
Package Equivalence Code
DIP28,.6
Programming Voltage
12.75 V
Standby Current-Max
0.0001 A
Terminal Finish
TIN LEAD
Compare AM27C256-200PI with alternatives
Compare NMC27C256BN200 with alternatives