AM27C256-175DCB vs 5962-8606304XA feature comparison

AM27C256-175DCB AMD

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5962-8606304XA Micross Components

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Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer ADVANCED MICRO DEVICES INC AUSTIN SEMICONDUCTOR INC
Part Package Code DIP DIP
Package Description WDIP, 0.600 INCH, CERAMIC, DIP-28
Pin Count 28 28
Reach Compliance Code unknown unknown
ECCN Code EAR99 3A001.A.2.C
HTS Code 8542.32.00.61 8542.32.00.61
Access Time-Max 170 ns 170 ns
JESD-30 Code R-GDIP-T28 R-CDIP-T28
Length 37.1475 mm
Memory Density 262144 bit 262144 bit
Memory IC Type UVPROM UVPROM
Memory Width 8 8
Number of Functions 1 1
Number of Terminals 28 28
Number of Words 32768 words 32768 words
Number of Words Code 32000 32000
Operating Mode ASYNCHRONOUS ASYNCHRONOUS
Operating Temperature-Max 70 °C 125 °C
Operating Temperature-Min -55 °C
Organization 32KX8 32KX8
Output Characteristics 3-STATE 3-STATE
Package Body Material CERAMIC, GLASS-SEALED CERAMIC, METAL-SEALED COFIRED
Package Code WDIP DIP
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE, WINDOW IN-LINE
Parallel/Serial PARALLEL PARALLEL
Qualification Status Not Qualified Not Qualified
Seated Height-Max 5.588 mm 5.8928 mm
Supply Current-Max 0.05 mA 0.05 mA
Supply Voltage-Max (Vsup) 5.25 V 5.5 V
Supply Voltage-Min (Vsup) 4.75 V 4.5 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount NO NO
Technology CMOS CMOS
Temperature Grade COMMERCIAL MILITARY
Terminal Form THROUGH-HOLE THROUGH-HOLE
Terminal Pitch 2.54 mm 2.54 mm
Terminal Position DUAL DUAL
Width 15.24 mm 15.24 mm
Base Number Matches 1 9
I/O Type COMMON
JESD-609 Code e0
Package Equivalence Code DIP28,.6
Programming Voltage 12.5 V
Screening Level MIL-STD-883
Standby Current-Max 0.0003 A
Terminal Finish TIN LEAD

Compare AM27C256-175DCB with alternatives

Compare 5962-8606304XA with alternatives