AM27C256-170LE vs 8411104ZA feature comparison

AM27C256-170LE AMD

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8411104ZA Rochester Electronics LLC

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Part Life Cycle Code Obsolete Active
Ihs Manufacturer ADVANCED MICRO DEVICES INC ROCHESTER ELECTRONICS LLC
Part Package Code QFJ QFJ
Package Description WQCCN, CERAMIC, LCC-32
Pin Count 32 32
Reach Compliance Code unknown unknown
ECCN Code 3A001.A.2.C 3A001.A.2.C
HTS Code 8542.32.00.61 8542.32.00.61
Access Time-Max 170 ns 170 ns
JESD-30 Code R-CQCC-N32 R-CQCC-N32
Length 13.97 mm
Memory Density 262144 bit 262144 bit
Memory IC Type UVPROM UVPROM
Memory Width 8 8
Number of Functions 1 1
Number of Terminals 32 32
Number of Words 32768 words 32768 words
Number of Words Code 32000 32000
Operating Mode ASYNCHRONOUS ASYNCHRONOUS
Operating Temperature-Max 125 °C 125 °C
Operating Temperature-Min -55 °C -55 °C
Organization 32KX8 32KX8
Output Characteristics 3-STATE 3-STATE
Package Body Material CERAMIC, METAL-SEALED COFIRED CERAMIC, METAL-SEALED COFIRED
Package Code WQCCN QCCN
Package Shape RECTANGULAR RECTANGULAR
Package Style CHIP CARRIER, WINDOW CHIP CARRIER
Parallel/Serial PARALLEL PARALLEL
Qualification Status Not Qualified Not Qualified
Seated Height-Max 3.556 mm
Supply Current-Max 0.05 mA 0.14 mA
Supply Voltage-Max (Vsup) 5.5 V 5.5 V
Supply Voltage-Min (Vsup) 4.5 V 4.5 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade MILITARY MILITARY
Terminal Form NO LEAD NO LEAD
Terminal Pitch 1.27 mm 1.27 mm
Terminal Position QUAD QUAD
Width 11.43 mm
Base Number Matches 1 2
Rohs Code No
I/O Type COMMON
Package Equivalence Code LCC32,.45X.55
Peak Reflow Temperature (Cel) NOT SPECIFIED
Programming Voltage 12.5 V
Screening Level MIL-STD-883
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED

Compare AM27C256-170LE with alternatives

Compare 8411104ZA with alternatives