AM27C256-155DIB
vs
AM27C256-150DE
feature comparison
All Stats
Differences Only
Part Life Cycle Code
Active
Active
Ihs Manufacturer
ROCHESTER ELECTRONICS LLC
CYPRESS SEMICONDUCTOR CORP
Package Description
DIP,
Reach Compliance Code
unknown
compliant
ECCN Code
EAR99
HTS Code
8542.32.00.61
Access Time-Max
150 ns
JESD-30 Code
R-GDIP-T28
Length
37.1475 mm
Memory Density
262144 bit
Memory IC Type
UVPROM
Memory Width
8
Number of Functions
1
Number of Terminals
28
Number of Words
32768 words
Number of Words Code
32000
Operating Mode
ASYNCHRONOUS
Operating Temperature-Max
85 °C
Operating Temperature-Min
-40 °C
Organization
32KX8
Package Body Material
CERAMIC, GLASS-SEALED
Package Code
DIP
Package Shape
RECTANGULAR
Package Style
IN-LINE
Parallel/Serial
PARALLEL
Peak Reflow Temperature (Cel)
NOT SPECIFIED
Seated Height-Max
5.588 mm
Supply Current-Max
0.025 mA
Supply Voltage-Max (Vsup)
5.25 V
Supply Voltage-Min (Vsup)
4.75 V
Supply Voltage-Nom (Vsup)
5 V
Surface Mount
NO
Technology
CMOS
Temperature Grade
INDUSTRIAL
Terminal Form
THROUGH-HOLE
Terminal Pitch
2.54 mm
Terminal Position
DUAL
Time@Peak Reflow Temperature-Max (s)
NOT SPECIFIED
Width
15.24 mm
Base Number Matches
2
4