AM27C256-150DI
vs
NM27C256QE150
feature comparison
Part Life Cycle Code |
Active
|
Contact Manufacturer
|
Ihs Manufacturer |
CYPRESS SEMICONDUCTOR CORP
|
ROCHESTER ELECTRONICS LLC
|
Reach Compliance Code |
compliant
|
unknown
|
Base Number Matches |
3
|
4
|
Package Description |
|
WINDOWED, CERDIP-28
|
ECCN Code |
|
EAR99
|
HTS Code |
|
8542.32.00.61
|
Access Time-Max |
|
150 ns
|
JESD-30 Code |
|
R-GDIP-T28
|
JESD-609 Code |
|
e0
|
Memory Density |
|
262144 bit
|
Memory IC Type |
|
UVPROM
|
Memory Width |
|
8
|
Number of Functions |
|
1
|
Number of Terminals |
|
28
|
Number of Words |
|
32768 words
|
Number of Words Code |
|
32000
|
Operating Mode |
|
ASYNCHRONOUS
|
Operating Temperature-Max |
|
85 °C
|
Operating Temperature-Min |
|
-40 °C
|
Organization |
|
32KX8
|
Package Body Material |
|
CERAMIC, GLASS-SEALED
|
Package Code |
|
DIP
|
Package Shape |
|
RECTANGULAR
|
Package Style |
|
IN-LINE
|
Parallel/Serial |
|
PARALLEL
|
Seated Height-Max |
|
5.969 mm
|
Supply Current-Max |
|
0.035 mA
|
Supply Voltage-Max (Vsup) |
|
5.5 V
|
Supply Voltage-Min (Vsup) |
|
4.5 V
|
Supply Voltage-Nom (Vsup) |
|
5 V
|
Surface Mount |
|
NO
|
Technology |
|
CMOS
|
Temperature Grade |
|
INDUSTRIAL
|
Terminal Finish |
|
TIN LEAD
|
Terminal Form |
|
THROUGH-HOLE
|
Terminal Pitch |
|
2.54 mm
|
Terminal Position |
|
DUAL
|
Width |
|
15.24 mm
|
|
|
|