AM27C256-150DEB vs AM27C256-150DCB feature comparison

AM27C256-150DEB Cypress Semiconductor

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AM27C256-150DCB Spansion

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Part Life Cycle Code Active Obsolete
Ihs Manufacturer CYPRESS SEMICONDUCTOR CORP SPANSION INC
Reach Compliance Code compliant unknown
Base Number Matches 4 4
Part Package Code DIP
Package Description DIP,
Pin Count 28
ECCN Code EAR99
HTS Code 8542.32.00.61
Access Time-Max 150 ns
JESD-30 Code R-CDIP-T28
Length 37.1475 mm
Memory Density 262144 bit
Memory IC Type UVPROM
Memory Width 8
Number of Functions 1
Number of Terminals 28
Number of Words 32768 words
Number of Words Code 32000
Operating Mode ASYNCHRONOUS
Operating Temperature-Max 70 °C
Operating Temperature-Min
Organization 32KX8
Package Body Material CERAMIC, METAL-SEALED COFIRED
Package Code DIP
Package Shape RECTANGULAR
Package Style IN-LINE
Parallel/Serial PARALLEL
Qualification Status Not Qualified
Seated Height-Max 5.588 mm
Supply Current-Max 0.025 mA
Supply Voltage-Max (Vsup) 5.5 V
Supply Voltage-Min (Vsup) 4.5 V
Supply Voltage-Nom (Vsup) 5 V
Surface Mount NO
Technology CMOS
Temperature Grade COMMERCIAL
Terminal Form THROUGH-HOLE
Terminal Pitch 2.54 mm
Terminal Position DUAL
Width 15.24 mm

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