AM27C256-150DE
vs
M27C256B-25XF6
feature comparison
All Stats
Differences Only
Part Life Cycle Code
Active
Obsolete
Ihs Manufacturer
CYPRESS SEMICONDUCTOR CORP
STMICROELECTRONICS
Reach Compliance Code
compliant
compliant
Base Number Matches
4
1
Rohs Code
Part Package Code
DIP
Package Description
0.280 INCH, LEAD FREE, CERAMIC, WINDOWED, FRIT SEALED, DIP-28
Pin Count
28
ECCN Code
EAR99
HTS Code
8542.32.00.61
Access Time-Max
150 ns
I/O Type
COMMON
JESD-30 Code
R-CDIP-T28
JESD-609 Code
e3
Length
36.92 mm
Memory Density
262144 bit
Memory IC Type
UVPROM
Memory Width
8
Number of Functions
1
Number of Terminals
28
Number of Words
32768 words
Number of Words Code
32000
Operating Mode
ASYNCHRONOUS
Operating Temperature-Max
85 °C
Operating Temperature-Min
-40 °C
Organization
32KX8
Output Characteristics
3-STATE
Package Body Material
CERAMIC, METAL-SEALED COFIRED
Package Code
WDIP
Package Equivalence Code
DIP28,.6
Package Shape
RECTANGULAR
Package Style
IN-LINE, WINDOW
Parallel/Serial
PARALLEL
Programming Voltage
12.75 V
Qualification Status
Not Qualified
Seated Height-Max
5.72 mm
Standby Current-Max
0.0002 A
Supply Current-Max
0.03 mA
Supply Voltage-Max (Vsup)
5.25 V
Supply Voltage-Min (Vsup)
4.75 V
Supply Voltage-Nom (Vsup)
5 V
Surface Mount
NO
Technology
CMOS
Temperature Grade
INDUSTRIAL
Terminal Finish
MATTE TIN
Terminal Form
THROUGH-HOLE
Terminal Pitch
2.54 mm
Terminal Position
DUAL
Width
15.24 mm
Compare M27C256B-25XF6 with alternatives