AM27C256-120DI vs M27C256B-12F7X feature comparison

AM27C256-120DI Spansion

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M27C256B-12F7X STMicroelectronics

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Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer SPANSION INC STMICROELECTRONICS
Part Package Code DIP DIP
Package Description DIP-28 WDIP,
Pin Count 28 28
Reach Compliance Code unknown unknown
ECCN Code EAR99 EAR99
HTS Code 8542.32.00.61 8542.32.00.61
Access Time-Max 120 ns 120 ns
JESD-30 Code R-CDIP-T28 R-GDIP-T28
Length 37.1475 mm
Memory Density 262144 bit 262144 bit
Memory IC Type UVPROM UVPROM
Memory Width 8 8
Number of Functions 1 1
Number of Terminals 28 28
Number of Words 32768 words 32768 words
Number of Words Code 32000 32000
Operating Mode ASYNCHRONOUS ASYNCHRONOUS
Operating Temperature-Max 85 °C 105 °C
Operating Temperature-Min -40 °C -40 °C
Organization 32KX8 32KX8
Package Body Material CERAMIC, METAL-SEALED COFIRED CERAMIC, GLASS-SEALED
Package Code DIP WDIP
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE IN-LINE, WINDOW
Parallel/Serial PARALLEL PARALLEL
Qualification Status Not Qualified Not Qualified
Seated Height-Max 5.588 mm 5.71 mm
Supply Current-Max 0.025 mA 0.03 mA
Supply Voltage-Max (Vsup) 5.5 V 5.5 V
Supply Voltage-Min (Vsup) 4.5 V 4.5 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount NO NO
Technology CMOS CMOS
Temperature Grade INDUSTRIAL INDUSTRIAL
Terminal Form THROUGH-HOLE THROUGH-HOLE
Terminal Pitch 2.54 mm 2.54 mm
Terminal Position DUAL DUAL
Width 15.24 mm 15.24 mm
Base Number Matches 2 1

Compare AM27C256-120DI with alternatives

Compare M27C256B-12F7X with alternatives