AM27C128-200JC vs AM27X128-200JC feature comparison

AM27C128-200JC AMD

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AM27X128-200JC Spansion

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Rohs Code No
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer ADVANCED MICRO DEVICES INC SPANSION INC
Part Package Code QFJ QFJ
Package Description QCCJ, LDCC32,.5X.6 QCCJ,
Pin Count 32 32
Reach Compliance Code unknown unknown
ECCN Code EAR99 EAR99
HTS Code 8542.32.00.71 8542.32.00.71
Access Time-Max 200 ns 80 ns
I/O Type COMMON
JESD-30 Code R-PQCC-J32 R-PQCC-J32
JESD-609 Code e0
Memory Density 131072 bit 1048576 bit
Memory IC Type OTP ROM OTP ROM
Memory Width 8 16
Number of Functions 1 1
Number of Terminals 32 32
Number of Words 16384 words 16384 words
Number of Words Code 16000 64000
Operating Mode ASYNCHRONOUS ASYNCHRONOUS
Operating Temperature-Max 70 °C 70 °C
Operating Temperature-Min
Organization 16KX8 64KX16
Output Characteristics 3-STATE
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code QCCJ QCCJ
Package Equivalence Code LDCC32,.5X.6
Package Shape RECTANGULAR RECTANGULAR
Package Style CHIP CARRIER CHIP CARRIER
Parallel/Serial PARALLEL PARALLEL
Programming Voltage 12.75 V
Qualification Status Not Qualified Not Qualified
Standby Current-Max 0.0001 A
Supply Current-Max 0.025 mA 0.025 mA
Supply Voltage-Max (Vsup) 5.5 V 5.25 V
Supply Voltage-Min (Vsup) 4.5 V 4.75 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade COMMERCIAL COMMERCIAL
Terminal Finish Tin/Lead (Sn/Pb)
Terminal Form J BEND J BEND
Terminal Pitch 1.27 mm 1.27 mm
Terminal Position QUAD QUAD
Base Number Matches 1 1
Length 13.97 mm
Seated Height-Max 3.556 mm
Width 11.43 mm

Compare AM27C128-200JC with alternatives

Compare AM27X128-200JC with alternatives