AM27C1024-70DC
vs
M27C1024-20XF6
feature comparison
Part Life Cycle Code |
Active
|
Obsolete
|
Ihs Manufacturer |
CYPRESS SEMICONDUCTOR CORP
|
STMICROELECTRONICS
|
Reach Compliance Code |
compliant
|
compliant
|
Base Number Matches |
3
|
1
|
Rohs Code |
|
Yes
|
Part Package Code |
|
DIP
|
Package Description |
|
WINDOWED, FRIT SEALED, CERAMIC, DIP-40
|
Pin Count |
|
40
|
ECCN Code |
|
EAR99
|
HTS Code |
|
8542.32.00.61
|
Access Time-Max |
|
100 ns
|
I/O Type |
|
COMMON
|
JESD-30 Code |
|
R-GDIP-T40
|
JESD-609 Code |
|
e3
|
Length |
|
52.195 mm
|
Memory Density |
|
1048576 bit
|
Memory IC Type |
|
UVPROM
|
Memory Width |
|
16
|
Number of Functions |
|
1
|
Number of Terminals |
|
40
|
Number of Words |
|
65536 words
|
Number of Words Code |
|
64000
|
Operating Mode |
|
ASYNCHRONOUS
|
Operating Temperature-Max |
|
85 °C
|
Operating Temperature-Min |
|
-40 °C
|
Organization |
|
64KX16
|
Output Characteristics |
|
3-STATE
|
Package Body Material |
|
CERAMIC, GLASS-SEALED
|
Package Code |
|
WDIP
|
Package Equivalence Code |
|
DIP40,.6
|
Package Shape |
|
RECTANGULAR
|
Package Style |
|
IN-LINE, WINDOW
|
Parallel/Serial |
|
PARALLEL
|
Qualification Status |
|
Not Qualified
|
Seated Height-Max |
|
5.97 mm
|
Standby Current-Max |
|
0.0001 A
|
Supply Current-Max |
|
0.035 mA
|
Supply Voltage-Max (Vsup) |
|
5.25 V
|
Supply Voltage-Min (Vsup) |
|
4.75 V
|
Supply Voltage-Nom (Vsup) |
|
5 V
|
Surface Mount |
|
NO
|
Technology |
|
CMOS
|
Temperature Grade |
|
INDUSTRIAL
|
Terminal Finish |
|
MATTE TIN
|
Terminal Form |
|
THROUGH-HOLE
|
Terminal Pitch |
|
2.54 mm
|
Terminal Position |
|
DUAL
|
Width |
|
15.24 mm
|
|
|
|
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