AM27C1024-55JC5
vs
M27C1024-55B7X
feature comparison
Rohs Code |
No
|
Yes
|
Part Life Cycle Code |
Obsolete
|
Obsolete
|
Ihs Manufacturer |
ADVANCED MICRO DEVICES INC
|
STMICROELECTRONICS
|
Part Package Code |
LCC
|
DIP
|
Package Description |
QCCJ, LDCC44,.7SQ
|
DIP, DIP40,.6
|
Pin Count |
44
|
40
|
Reach Compliance Code |
unknown
|
compliant
|
ECCN Code |
EAR99
|
EAR99
|
HTS Code |
8542.32.00.71
|
8542.32.00.71
|
Access Time-Max |
55 ns
|
55 ns
|
I/O Type |
COMMON
|
COMMON
|
JESD-30 Code |
S-PQCC-J44
|
R-PDIP-T40
|
JESD-609 Code |
e0
|
e3
|
Memory Density |
1048576 bit
|
1048576 bit
|
Memory IC Type |
OTP ROM
|
OTP ROM
|
Memory Width |
16
|
16
|
Number of Functions |
1
|
1
|
Number of Terminals |
44
|
40
|
Number of Words |
65536 words
|
65536 words
|
Number of Words Code |
64000
|
64000
|
Operating Mode |
ASYNCHRONOUS
|
ASYNCHRONOUS
|
Operating Temperature-Max |
70 °C
|
105 °C
|
Operating Temperature-Min |
|
-40 °C
|
Organization |
64KX16
|
64KX16
|
Output Characteristics |
3-STATE
|
3-STATE
|
Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
Package Code |
QCCJ
|
DIP
|
Package Equivalence Code |
LDCC44,.7SQ
|
DIP40,.6
|
Package Shape |
SQUARE
|
RECTANGULAR
|
Package Style |
CHIP CARRIER
|
IN-LINE
|
Parallel/Serial |
PARALLEL
|
PARALLEL
|
Qualification Status |
Not Qualified
|
Not Qualified
|
Standby Current-Max |
0.0001 A
|
0.0001 A
|
Supply Current-Max |
0.05 mA
|
0.035 mA
|
Supply Voltage-Max (Vsup) |
5.25 V
|
5.5 V
|
Supply Voltage-Min (Vsup) |
4.75 V
|
4.5 V
|
Supply Voltage-Nom (Vsup) |
5 V
|
5 V
|
Surface Mount |
YES
|
NO
|
Technology |
CMOS
|
CMOS
|
Temperature Grade |
COMMERCIAL
|
INDUSTRIAL
|
Terminal Finish |
TIN LEAD
|
MATTE TIN
|
Terminal Form |
J BEND
|
THROUGH-HOLE
|
Terminal Pitch |
1.27 mm
|
2.54 mm
|
Terminal Position |
QUAD
|
DUAL
|
Base Number Matches |
1
|
1
|
Length |
|
52.18 mm
|
Width |
|
15.24 mm
|
|
|
|
Compare AM27C1024-55JC5 with alternatives
Compare M27C1024-55B7X with alternatives