AM27C1024-200/BQA
vs
AM27C1024-205DCB
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
ADVANCED MICRO DEVICES INC
ADVANCED MICRO DEVICES INC
Part Package Code
DIP
DIP
Package Description
WDIP, DIP40,.6
WDIP, DIP40,.6
Pin Count
40
40
Reach Compliance Code
unknown
unknown
ECCN Code
3A001.A.2.C
EAR99
HTS Code
8542.32.00.61
8542.32.00.61
Access Time-Max
200 ns
200 ns
I/O Type
COMMON
COMMON
JESD-30 Code
R-GDIP-T40
R-GDIP-T40
JESD-609 Code
e0
e0
Length
52.2605 mm
52.2605 mm
Memory Density
1048576 bit
1048576 bit
Memory IC Type
UVPROM
UVPROM
Memory Width
16
16
Number of Functions
1
1
Number of Terminals
40
40
Number of Words
65536 words
65536 words
Number of Words Code
64000
64000
Operating Mode
ASYNCHRONOUS
ASYNCHRONOUS
Operating Temperature-Max
125 °C
70 °C
Operating Temperature-Min
-55 °C
Organization
64KX16
64KX16
Output Characteristics
3-STATE
3-STATE
Package Body Material
CERAMIC, GLASS-SEALED
CERAMIC, GLASS-SEALED
Package Code
WDIP
WDIP
Package Equivalence Code
DIP40,.6
DIP40,.6
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
IN-LINE, WINDOW
IN-LINE, WINDOW
Parallel/Serial
PARALLEL
PARALLEL
Qualification Status
Not Qualified
Not Qualified
Screening Level
38535Q/M;38534H;883B
Seated Height-Max
5.588 mm
5.588 mm
Standby Current-Max
0.0001 A
Supply Current-Max
0.06 mA
0.05 mA
Supply Voltage-Max (Vsup)
5.5 V
5.25 V
Supply Voltage-Min (Vsup)
4.5 V
4.75 V
Supply Voltage-Nom (Vsup)
5 V
5 V
Surface Mount
NO
NO
Technology
CMOS
CMOS
Temperature Grade
MILITARY
COMMERCIAL
Terminal Finish
Tin/Lead (Sn/Pb)
TIN LEAD
Terminal Form
THROUGH-HOLE
THROUGH-HOLE
Terminal Pitch
2.54 mm
2.54 mm
Terminal Position
DUAL
DUAL
Width
15.24 mm
15.24 mm
Base Number Matches
1
1
Pbfree Code
Compare AM27C1024-200/BQA with alternatives
Compare AM27C1024-205DCB with alternatives