AM27C080-125DC vs M27V801-200P1 feature comparison

AM27C080-125DC AMD

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M27V801-200P1 STMicroelectronics

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Pbfree Code No
Rohs Code No No
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer ADVANCED MICRO DEVICES INC STMICROELECTRONICS
Part Package Code DIP DIP
Package Description WDIP, DIP32,.6 0.600 INCH, PLASTIC, DIP-32
Pin Count 32 32
Reach Compliance Code unknown not_compliant
ECCN Code EAR99 EAR99
HTS Code 8542.32.00.61 8542.32.00.71
Access Time-Max 120 ns 200 ns
I/O Type COMMON COMMON
JESD-30 Code R-GDIP-T32 R-PDIP-T32
JESD-609 Code e0 e0
Length 42.1005 mm 41.91 mm
Memory Density 8388608 bit 8388608 bit
Memory IC Type UVPROM OTP ROM
Memory Width 8 8
Number of Functions 1 1
Number of Terminals 32 32
Number of Words 1048576 words 1048576 words
Number of Words Code 1000000 1000000
Operating Mode ASYNCHRONOUS ASYNCHRONOUS
Operating Temperature-Max 70 °C 70 °C
Operating Temperature-Min
Organization 1MX8 1MX8
Output Characteristics 3-STATE 3-STATE
Package Body Material CERAMIC, GLASS-SEALED PLASTIC/EPOXY
Package Code WDIP DIP
Package Equivalence Code DIP32,.6 DIP32,.6
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE, WINDOW IN-LINE
Parallel/Serial PARALLEL PARALLEL
Qualification Status Not Qualified Not Qualified
Seated Height-Max 5.588 mm 5.08 mm
Supply Current-Max 0.00004 mA 0.015 mA
Supply Voltage-Max (Vsup) 5.25 V 3.63 V
Supply Voltage-Min (Vsup) 4.75 V 2.97 V
Supply Voltage-Nom (Vsup) 5 V 3.3 V
Surface Mount NO NO
Technology CMOS CMOS
Temperature Grade COMMERCIAL COMMERCIAL
Terminal Finish TIN LEAD TIN LEAD
Terminal Form THROUGH-HOLE THROUGH-HOLE
Terminal Pitch 2.54 mm 2.54 mm
Terminal Position DUAL DUAL
Width 15.24 mm 15.24 mm
Base Number Matches 1 1
Standby Current-Max 0.00002 A

Compare AM27C080-125DC with alternatives

Compare M27V801-200P1 with alternatives