AM27C020-255DEB
vs
AM27C020-255DI
feature comparison
| Rohs Code |
No
|
|
| Part Life Cycle Code |
Obsolete
|
Active
|
| Ihs Manufacturer |
ADVANCED MICRO DEVICES INC
|
CYPRESS SEMICONDUCTOR CORP
|
| Part Package Code |
DIP
|
|
| Package Description |
WDIP, DIP32,.6
|
|
| Pin Count |
32
|
|
| Reach Compliance Code |
unknown
|
compliant
|
| ECCN Code |
3A001.A.2.C
|
|
| HTS Code |
8542.32.00.61
|
|
| Access Time-Max |
250 ns
|
|
| I/O Type |
COMMON
|
|
| JESD-30 Code |
R-GDIP-T32
|
|
| JESD-609 Code |
e0
|
|
| Length |
42.1005 mm
|
|
| Memory Density |
2097152 bit
|
|
| Memory IC Type |
UVPROM
|
|
| Memory Width |
8
|
|
| Number of Functions |
1
|
|
| Number of Terminals |
32
|
|
| Number of Words |
262144 words
|
|
| Number of Words Code |
256000
|
|
| Operating Mode |
ASYNCHRONOUS
|
|
| Operating Temperature-Max |
125 °C
|
|
| Operating Temperature-Min |
-55 °C
|
|
| Organization |
256KX8
|
|
| Output Characteristics |
3-STATE
|
|
| Package Body Material |
CERAMIC, GLASS-SEALED
|
|
| Package Code |
WDIP
|
|
| Package Equivalence Code |
DIP32,.6
|
|
| Package Shape |
RECTANGULAR
|
|
| Package Style |
IN-LINE, WINDOW
|
|
| Parallel/Serial |
PARALLEL
|
|
| Qualification Status |
Not Qualified
|
|
| Seated Height-Max |
5.588 mm
|
|
| Standby Current-Max |
0.0001 A
|
|
| Supply Current-Max |
0.06 mA
|
|
| Supply Voltage-Max (Vsup) |
5.25 V
|
|
| Supply Voltage-Min (Vsup) |
4.75 V
|
|
| Supply Voltage-Nom (Vsup) |
5 V
|
|
| Surface Mount |
NO
|
|
| Technology |
CMOS
|
|
| Temperature Grade |
MILITARY
|
|
| Terminal Finish |
Tin/Lead (Sn/Pb)
|
|
| Terminal Form |
THROUGH-HOLE
|
|
| Terminal Pitch |
2.54 mm
|
|
| Terminal Position |
DUAL
|
|
| Width |
15.24 mm
|
|
| Base Number Matches |
1
|
3
|
|
|
|
Compare AM27C020-255DEB with alternatives