AM27C020-255DCB
vs
AM27C020-255DI
feature comparison
All Stats
Differences Only
Part Life Cycle Code
Active
Obsolete
Ihs Manufacturer
CYPRESS SEMICONDUCTOR CORP
ADVANCED MICRO DEVICES INC
Reach Compliance Code
compliant
unknown
Base Number Matches
3
3
Rohs Code
Part Package Code
DIP
Package Description
DIP, DIP32,.6
Pin Count
32
ECCN Code
EAR99
HTS Code
8542.32.00.61
Access Time-Max
250 ns
I/O Type
COMMON
JESD-30 Code
R-CDIP-T32
JESD-609 Code
e0
Memory Density
2097152 bit
Memory IC Type
UVPROM
Memory Width
8
Number of Functions
1
Number of Terminals
32
Number of Words
262144 words
Number of Words Code
256000
Operating Mode
ASYNCHRONOUS
Operating Temperature-Max
85 °C
Operating Temperature-Min
-40 °C
Organization
256KX8
Output Characteristics
3-STATE
Package Body Material
CERAMIC, METAL-SEALED COFIRED
Package Code
DIP
Package Equivalence Code
DIP32,.6
Package Shape
RECTANGULAR
Package Style
IN-LINE
Parallel/Serial
PARALLEL
Qualification Status
Not Qualified
Standby Current-Max
0.0001 A
Supply Current-Max
0.03 mA
Supply Voltage-Max (Vsup)
5.25 V
Supply Voltage-Min (Vsup)
4.75 V
Supply Voltage-Nom (Vsup)
5 V
Surface Mount
NO
Technology
CMOS
Temperature Grade
INDUSTRIAL
Terminal Finish
TIN LEAD
Terminal Form
THROUGH-HOLE
Terminal Pitch
2.54 mm
Terminal Position
DUAL