AM27C020-200DI vs AM27C020-200DCB feature comparison

AM27C020-200DI AMD

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AM27C020-200DCB Cypress Semiconductor

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Rohs Code No
Part Life Cycle Code Obsolete Active
Ihs Manufacturer ADVANCED MICRO DEVICES INC CYPRESS SEMICONDUCTOR CORP
Part Package Code DIP
Package Description DIP, DIP32,.6
Pin Count 32
Reach Compliance Code unknown compliant
ECCN Code EAR99
HTS Code 8542.32.00.61
Access Time-Max 200 ns
I/O Type COMMON
JESD-30 Code R-CDIP-T32
JESD-609 Code e0
Memory Density 2097152 bit
Memory IC Type UVPROM
Memory Width 8
Number of Functions 1
Number of Terminals 32
Number of Words 262144 words
Number of Words Code 256000
Operating Mode ASYNCHRONOUS
Operating Temperature-Max 85 °C
Operating Temperature-Min -40 °C
Organization 256KX8
Output Characteristics 3-STATE
Package Body Material CERAMIC, METAL-SEALED COFIRED
Package Code DIP
Package Equivalence Code DIP32,.6
Package Shape RECTANGULAR
Package Style IN-LINE
Parallel/Serial PARALLEL
Qualification Status Not Qualified
Standby Current-Max 0.0001 A
Supply Current-Max 0.03 mA
Supply Voltage-Max (Vsup) 5.5 V
Supply Voltage-Min (Vsup) 4.5 V
Supply Voltage-Nom (Vsup) 5 V
Surface Mount NO
Technology CMOS
Temperature Grade INDUSTRIAL
Terminal Finish TIN LEAD
Terminal Form THROUGH-HOLE
Terminal Pitch 2.54 mm
Terminal Position DUAL
Base Number Matches 3 3

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