AM25LS2539DM
vs
HD74AC538P
feature comparison
All Stats
Differences Only
Rohs Code
No
No
Part Life Cycle Code
Obsolete
Transferred
Ihs Manufacturer
ADVANCED MICRO DEVICES INC
HITACHI LTD
Part Package Code
DIP
DIP
Package Description
DIP, DIP20,.3
DIP, DIP20,.3
Pin Count
20
20
Reach Compliance Code
unknown
unknown
ECCN Code
EAR99
EAR99
HTS Code
8542.39.00.01
8542.39.00.01
Family
LS
AC
Input Conditioning
STANDARD
JESD-30 Code
R-GDIP-T20
R-PDIP-T20
JESD-609 Code
e0
e0
Length
24.4602 mm
24.5 mm
Load Capacitance (CL)
50 pF
50 pF
Logic IC Type
2-LINE TO 4-LINE DECODER
3-LINE TO 8-LINE DECODER
Number of Functions
2
1
Number of Terminals
20
20
Operating Temperature-Max
125 °C
85 °C
Operating Temperature-Min
-55 °C
-40 °C
Output Characteristics
3-STATE
Output Polarity
CONFIGURABLE
CONFIGURABLE
Package Body Material
CERAMIC, GLASS-SEALED
PLASTIC/EPOXY
Package Code
DIP
DIP
Package Equivalence Code
DIP20,.3
DIP20,.3
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
IN-LINE
IN-LINE
Power Supply Current-Max (ICC)
37 mA
Propagation Delay (tpd)
48 ns
20 ns
Qualification Status
Not Qualified
Not Qualified
Screening Level
MIL-STD-883 Class C
Seated Height-Max
5.08 mm
5.08 mm
Supply Voltage-Max (Vsup)
5.5 V
6 V
Supply Voltage-Min (Vsup)
4.5 V
2 V
Supply Voltage-Nom (Vsup)
5 V
5 V
Surface Mount
NO
NO
Technology
TTL
CMOS
Temperature Grade
MILITARY
INDUSTRIAL
Terminal Finish
TIN LEAD
Tin/Lead (Sn/Pb)
Terminal Form
THROUGH-HOLE
THROUGH-HOLE
Terminal Pitch
2.54 mm
2.54 mm
Terminal Position
DUAL
DUAL
Width
7.62 mm
7.62 mm
Base Number Matches
2
2
Prop. Delay@Nom-Sup
20 ns
Compare AM25LS2539DM with alternatives
Compare HD74AC538P with alternatives