AM25LS2536DMB
vs
A6B259KA
feature comparison
Rohs Code |
No
|
Yes
|
Part Life Cycle Code |
Obsolete
|
Obsolete
|
Ihs Manufacturer |
ADVANCED MICRO DEVICES INC
|
ALLEGRO MICROSYSTEMS LLC
|
Part Package Code |
DIP
|
DIP
|
Package Description |
DIP, DIP20,.3
|
DIP,
|
Pin Count |
20
|
20
|
Reach Compliance Code |
unknown
|
unknown
|
ECCN Code |
EAR99
|
EAR99
|
HTS Code |
8542.39.00.01
|
8542.39.00.01
|
Family |
LS
|
6B
|
Input Conditioning |
REGISTERED
|
LATCHED
|
JESD-30 Code |
R-GDIP-T20
|
R-PDIP-T20
|
JESD-609 Code |
e0
|
e3
|
Length |
24.4602 mm
|
25.905 mm
|
Load Capacitance (CL) |
45 pF
|
|
Logic IC Type |
3-LINE TO 8-LINE DECODER
|
3-LINE TO 8-LINE DECODER
|
Number of Functions |
1
|
1
|
Number of Terminals |
20
|
20
|
Operating Temperature-Max |
125 °C
|
125 °C
|
Operating Temperature-Min |
-55 °C
|
-40 °C
|
Output Characteristics |
3-STATE
|
OPEN-DRAIN
|
Output Polarity |
CONFIGURABLE
|
TRUE
|
Package Body Material |
CERAMIC, GLASS-SEALED
|
PLASTIC/EPOXY
|
Package Code |
DIP
|
DIP
|
Package Equivalence Code |
DIP20,.3
|
DIP20,.3
|
Package Shape |
RECTANGULAR
|
RECTANGULAR
|
Package Style |
IN-LINE
|
IN-LINE
|
Power Supply Current-Max (ICC) |
56 mA
|
|
Propagation Delay (tpd) |
42 ns
|
|
Qualification Status |
Not Qualified
|
Not Qualified
|
Screening Level |
MIL-STD-883 Class B (Modified)
|
|
Seated Height-Max |
5.08 mm
|
5.33 mm
|
Supply Voltage-Max (Vsup) |
5.5 V
|
5.5 V
|
Supply Voltage-Min (Vsup) |
4.5 V
|
4.5 V
|
Supply Voltage-Nom (Vsup) |
5 V
|
5 V
|
Surface Mount |
NO
|
NO
|
Technology |
TTL
|
CMOS
|
Temperature Grade |
MILITARY
|
AUTOMOTIVE
|
Terminal Finish |
TIN LEAD
|
MATTE TIN
|
Terminal Form |
THROUGH-HOLE
|
THROUGH-HOLE
|
Terminal Pitch |
2.54 mm
|
2.54 mm
|
Terminal Position |
DUAL
|
DUAL
|
Width |
7.62 mm
|
7.62 mm
|
Base Number Matches |
1
|
1
|
Samacsys Manufacturer |
|
Allegro Microsystems
|
Additional Feature |
|
1:8 DMUX FOLLOWED BY LATCH
|
|
|
|
Compare AM25LS2536DMB with alternatives
Compare A6B259KA with alternatives