AM25LS2535DC vs 54LS258A/BFA feature comparison

AM25LS2535DC AMD

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54LS258A/BFA YAGEO Corporation

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Rohs Code No
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer ADVANCED MICRO DEVICES INC PHILIPS COMPONENTS
Part Package Code DIP
Package Description DIP, DIP20,.3 ,
Pin Count 20
Reach Compliance Code unknown unknown
HTS Code 8542.39.00.01 8542.39.00.01
Family LS LS
JESD-30 Code R-GDIP-T20 R-CDFP-F16
JESD-609 Code e0
Length 24.4602 mm
Load Capacitance (CL) 50 pF 50 pF
Logic IC Type MULTIPLEXER MULTIPLEXER
Number of Functions 1 4
Number of Inputs 8 2
Number of Outputs 1 1
Number of Terminals 20 16
Operating Temperature-Max 70 °C 125 °C
Operating Temperature-Min -55 °C
Output Characteristics 3-STATE 3-STATE
Output Polarity CONFIGURABLE INVERTED
Package Body Material CERAMIC, GLASS-SEALED CERAMIC, METAL-SEALED COFIRED
Package Code DIP DFP
Package Equivalence Code DIP20,.3
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE FLATPACK
Power Supply Current-Max (ICC) 148 mA 14 mA
Propagation Delay (tpd) 35 ns 27 ns
Qualification Status Not Qualified Not Qualified
Seated Height-Max 5.08 mm
Supply Voltage-Max (Vsup) 5.25 V 5.5 V
Supply Voltage-Min (Vsup) 4.75 V 4.5 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount NO YES
Technology TTL TTL
Temperature Grade COMMERCIAL MILITARY
Terminal Finish TIN LEAD
Terminal Form THROUGH-HOLE FLAT
Terminal Pitch 2.54 mm
Terminal Position DUAL DUAL
Width 7.62 mm
Base Number Matches 4 1

Compare AM25LS2535DC with alternatives

Compare 54LS258A/BFA with alternatives