AM2167-55DEB
vs
HM4-65262B/883:RD
feature comparison
| Pbfree Code |
No
|
|
| Rohs Code |
No
|
|
| Part Life Cycle Code |
Obsolete
|
Obsolete
|
| Ihs Manufacturer |
ADVANCED MICRO DEVICES INC
|
ATMEL CORP
|
| Part Package Code |
DIP
|
|
| Package Description |
DIP, DIP20,.3
|
,
|
| Pin Count |
20
|
|
| Reach Compliance Code |
unknown
|
unknown
|
| ECCN Code |
3A001.A.2.C
|
EAR99
|
| HTS Code |
8542.32.00.41
|
8542.32.00.41
|
| Access Time-Max |
50 ns
|
|
| Additional Feature |
AUTOMATIC POWER-DOWN
|
|
| I/O Type |
SEPARATE
|
|
| JESD-30 Code |
R-GDIP-T20
|
|
| JESD-609 Code |
e0
|
|
| Length |
24.257 mm
|
|
| Memory Density |
16384 bit
|
|
| Memory IC Type |
STANDARD SRAM
|
STANDARD SRAM
|
| Memory Width |
1
|
|
| Number of Functions |
1
|
|
| Number of Ports |
1
|
|
| Number of Terminals |
20
|
|
| Number of Words |
16384 words
|
|
| Number of Words Code |
16000
|
|
| Operating Mode |
ASYNCHRONOUS
|
|
| Operating Temperature-Max |
125 °C
|
|
| Operating Temperature-Min |
-55 °C
|
|
| Organization |
16KX1
|
|
| Output Characteristics |
3-STATE
|
|
| Output Enable |
NO
|
|
| Package Body Material |
CERAMIC, GLASS-SEALED
|
|
| Package Code |
DIP
|
|
| Package Equivalence Code |
DIP20,.3
|
|
| Package Shape |
RECTANGULAR
|
|
| Package Style |
IN-LINE
|
|
| Parallel/Serial |
PARALLEL
|
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Seated Height-Max |
5.08 mm
|
|
| Supply Current-Max |
0.16 mA
|
|
| Supply Voltage-Max (Vsup) |
5.5 V
|
|
| Supply Voltage-Min (Vsup) |
4.5 V
|
|
| Supply Voltage-Nom (Vsup) |
5 V
|
|
| Surface Mount |
NO
|
|
| Technology |
NMOS
|
|
| Temperature Grade |
MILITARY
|
|
| Terminal Finish |
TIN LEAD
|
|
| Terminal Form |
THROUGH-HOLE
|
|
| Terminal Pitch |
2.54 mm
|
|
| Terminal Position |
DUAL
|
|
| Width |
7.62 mm
|
|
| Base Number Matches |
1
|
2
|
|
|
|
Compare AM2167-55DEB with alternatives
Compare HM4-65262B/883:RD with alternatives