AM2167-55DEB vs AM2167-35LCB feature comparison

AM2167-55DEB AMD

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AM2167-35LCB Msis Semiconductor Inc

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Pbfree Code No
Rohs Code No No
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer ADVANCED MICRO DEVICES INC MSIS SEMICONDUCTOR INC
Part Package Code DIP
Package Description DIP, DIP20,.3 QCCN, LCC20,.3X.43
Pin Count 20
Reach Compliance Code unknown unknown
ECCN Code 3A001.A.2.C EAR99
HTS Code 8542.32.00.41 8542.32.00.41
Access Time-Max 50 ns 35 ns
Additional Feature AUTOMATIC POWER-DOWN
I/O Type SEPARATE SEPARATE
JESD-30 Code R-GDIP-T20 R-XQCC-N20
JESD-609 Code e0 e0
Length 24.257 mm
Memory Density 16384 bit 16384 bit
Memory IC Type STANDARD SRAM STANDARD SRAM
Memory Width 1 1
Number of Functions 1
Number of Ports 1
Number of Terminals 20 20
Number of Words 16384 words 16384 words
Number of Words Code 16000 16000
Operating Mode ASYNCHRONOUS ASYNCHRONOUS
Operating Temperature-Max 125 °C 70 °C
Operating Temperature-Min -55 °C
Organization 16KX1 16KX1
Output Characteristics 3-STATE 3-STATE
Output Enable NO
Package Body Material CERAMIC, GLASS-SEALED CERAMIC
Package Code DIP QCCN
Package Equivalence Code DIP20,.3 LCC20,.3X.43
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE CHIP CARRIER
Parallel/Serial PARALLEL PARALLEL
Qualification Status Not Qualified
Seated Height-Max 5.08 mm
Supply Current-Max 0.16 mA 0.12 mA
Supply Voltage-Max (Vsup) 5.5 V
Supply Voltage-Min (Vsup) 4.5 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount NO YES
Technology NMOS MOS
Temperature Grade MILITARY COMMERCIAL
Terminal Finish TIN LEAD Tin/Lead (Sn/Pb)
Terminal Form THROUGH-HOLE NO LEAD
Terminal Pitch 2.54 mm 1.27 mm
Terminal Position DUAL QUAD
Width 7.62 mm
Base Number Matches 1 2

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