AM186ED-20KIW
vs
AM186EM-25KC/W
feature comparison
| Part Life Cycle Code |
Contact Manufacturer
|
Obsolete
|
| Ihs Manufacturer |
ROCHESTER ELECTRONICS LLC
|
ADVANCED MICRO DEVICES INC
|
| Package Description |
,
|
QFP, QFP100,.7X.9
|
| Reach Compliance Code |
unknown
|
compliant
|
| HTS Code |
8542.31.00.01
|
8542.31.00.01
|
| Technology |
CMOS
|
CMOS
|
| uPs/uCs/Peripheral ICs Type |
MICROCONTROLLER
|
MICROCONTROLLER
|
| Base Number Matches |
2
|
1
|
| Rohs Code |
|
No
|
| Part Package Code |
|
QFP
|
| Pin Count |
|
100
|
| ECCN Code |
|
3A991.A.2
|
| Has ADC |
|
NO
|
| Additional Feature |
|
ADDITIONAL 20 BIT NONMULTIPLEXED ADDRESS BUS
|
| Address Bus Width |
|
20
|
| Bit Size |
|
16
|
| Clock Frequency-Max |
|
40 MHz
|
| DAC Channels |
|
NO
|
| DMA Channels |
|
YES
|
| External Data Bus Width |
|
16
|
| JESD-30 Code |
|
R-PQFP-G100
|
| JESD-609 Code |
|
e0
|
| Length |
|
20 mm
|
| Number of I/O Lines |
|
32
|
| Number of Terminals |
|
100
|
| Operating Temperature-Max |
|
100 °C
|
| Operating Temperature-Min |
|
|
| PWM Channels |
|
NO
|
| Package Body Material |
|
PLASTIC/EPOXY
|
| Package Code |
|
QFP
|
| Package Equivalence Code |
|
QFP100,.7X.9
|
| Package Shape |
|
RECTANGULAR
|
| Package Style |
|
FLATPACK
|
| Qualification Status |
|
Not Qualified
|
| ROM Programmability |
|
FLASH
|
| Seated Height-Max |
|
3.35 mm
|
| Speed |
|
25 MHz
|
| Supply Current-Max |
|
135 mA
|
| Supply Voltage-Max |
|
5.5 V
|
| Supply Voltage-Min |
|
4.5 V
|
| Supply Voltage-Nom |
|
5 V
|
| Surface Mount |
|
YES
|
| Temperature Grade |
|
OTHER
|
| Terminal Finish |
|
TIN LEAD
|
| Terminal Form |
|
GULL WING
|
| Terminal Pitch |
|
0.65 mm
|
| Terminal Position |
|
QUAD
|
| Width |
|
14 mm
|
|
|
|
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