AM1808BZCE3
vs
AM1808BZCEA3
feature comparison
All Stats
Differences Only
Rohs Code
Yes
Yes
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
TEXAS INSTRUMENTS INC
TEXAS INSTRUMENTS INC
Part Package Code
BGA
BGA
Package Description
NFBGA-361
NFBGA-361
Pin Count
361
361
Reach Compliance Code
compliant
compliant
ECCN Code
3A991.A.2
3A991.A.2
HTS Code
8542.31.00.01
8542.31.00.01
Additional Feature
ALSO OPERATES AT 1V AND 1.1 V NOMINAL
ALSO OPERATES AT 1V AND 1.1 V NOMINAL
Address Bus Width
23
23
Bit Size
32
32
Boundary Scan
YES
YES
Clock Frequency-Max
50 MHz
50 MHz
External Data Bus Width
16
16
Format
FIXED POINT
FIXED POINT
Integrated Cache
YES
YES
JESD-30 Code
S-PBGA-B361
S-PBGA-B361
JESD-609 Code
e1
e1
Length
13 mm
13 mm
Low Power Mode
YES
YES
Moisture Sensitivity Level
3
3
Number of Terminals
361
361
Operating Temperature-Max
90 °C
105 °C
Operating Temperature-Min
-40 °C
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
LFBGA
LFBGA
Package Equivalence Code
BGA361,19X19,25
BGA361,19X19,25
Package Shape
SQUARE
SQUARE
Package Style
GRID ARRAY, LOW PROFILE, FINE PITCH
GRID ARRAY, LOW PROFILE, FINE PITCH
Peak Reflow Temperature (Cel)
260
260
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
1.3 mm
1.3 mm
Speed
375 MHz
375 MHz
Supply Voltage-Max
1.32 V
1.32 V
Supply Voltage-Min
1.14 V
1.14 V
Supply Voltage-Nom
1.2 V
1.2 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
OTHER
INDUSTRIAL
Terminal Finish
TIN SILVER COPPER
TIN SILVER COPPER
Terminal Form
BALL
BALL
Terminal Pitch
0.65 mm
0.65 mm
Terminal Position
BOTTOM
BOTTOM
Time@Peak Reflow Temperature-Max (s)
30
30
Width
13 mm
13 mm
uPs/uCs/Peripheral ICs Type
MICROPROCESSOR, RISC
MICROPROCESSOR, RISC
Base Number Matches
1
1