AM1808BZCE3 vs AM1808BZCEA3 feature comparison

AM1808BZCE3 Texas Instruments

Buy Now Datasheet

AM1808BZCEA3 Texas Instruments

Buy Now Datasheet
Rohs Code Yes Yes
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer TEXAS INSTRUMENTS INC TEXAS INSTRUMENTS INC
Part Package Code BGA BGA
Package Description NFBGA-361 NFBGA-361
Pin Count 361 361
Reach Compliance Code compliant compliant
ECCN Code 3A991.A.2 3A991.A.2
HTS Code 8542.31.00.01 8542.31.00.01
Additional Feature ALSO OPERATES AT 1V AND 1.1 V NOMINAL ALSO OPERATES AT 1V AND 1.1 V NOMINAL
Address Bus Width 23 23
Bit Size 32 32
Boundary Scan YES YES
Clock Frequency-Max 50 MHz 50 MHz
External Data Bus Width 16 16
Format FIXED POINT FIXED POINT
Integrated Cache YES YES
JESD-30 Code S-PBGA-B361 S-PBGA-B361
JESD-609 Code e1 e1
Length 13 mm 13 mm
Low Power Mode YES YES
Moisture Sensitivity Level 3 3
Number of Terminals 361 361
Operating Temperature-Max 90 °C 105 °C
Operating Temperature-Min -40 °C
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code LFBGA LFBGA
Package Equivalence Code BGA361,19X19,25 BGA361,19X19,25
Package Shape SQUARE SQUARE
Package Style GRID ARRAY, LOW PROFILE, FINE PITCH GRID ARRAY, LOW PROFILE, FINE PITCH
Peak Reflow Temperature (Cel) 260 260
Qualification Status Not Qualified Not Qualified
Seated Height-Max 1.3 mm 1.3 mm
Speed 375 MHz 375 MHz
Supply Voltage-Max 1.32 V 1.32 V
Supply Voltage-Min 1.14 V 1.14 V
Supply Voltage-Nom 1.2 V 1.2 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade OTHER INDUSTRIAL
Terminal Finish TIN SILVER COPPER TIN SILVER COPPER
Terminal Form BALL BALL
Terminal Pitch 0.65 mm 0.65 mm
Terminal Position BOTTOM BOTTOM
Time@Peak Reflow Temperature-Max (s) 30 30
Width 13 mm 13 mm
uPs/uCs/Peripheral ICs Type MICROPROCESSOR, RISC MICROPROCESSOR, RISC
Base Number Matches 1 1